Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.

Abstract: A peeling device is provided for detachment of a chip from an adhesive tape on which it is mounted. The device comprises a platform including a first surface and a raised contact surface set at a determinate height with respect to the first surface. The raised contact surface has a width that is smaller than a width of the chip for contacting the adhesive tape at a position of the chip. Further, an elevation device is projectable from the raised contact surface and movable with respect to the platform for lifting the chip away from the adhesive tape.

Abstract: The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component and a light-receiving component. It comprises first alignment means having a relatively lower optical resolving power stage that is adapted to perform coarse alignment of the light-emitting component to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving power stage that is adapted to perform fine alignment of the light-emitting component to locate a more precise location of the said point of highest intensity. Accordingly, coarse alignment may be performed using a multi-mode fiber and fine alignment may be performed using a single-mode fiber that may further be coupled to the light-emitting component.

Abstract: The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component and a light-receiving component. It comprises first alignment means having a relatively lower optical resolving power stage that is adapted to perform coarse alignment of the light-emitting component to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving power stage that is adapted to perform fine alignment of the light-emitting component to locate a more precise location of the said point of highest intensity. Accordingly, coarse alignment may be performed using a multi-mode fiber and fine alignment may be performed using a single-mode fiber that may further be coupled to the light-emitting component.