Patents by Inventor Ching-Hou Sue

Ching-Hou Sue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structures having a micro-battery and methods for making the same
    Patent number: 9240611
    Abstract: The present disclosure provides an embodiment of an integrated structure that includes a first electrode of a first conductive material embedded in a first semiconductor substrate; a second electrode of a second conductive material embedded in a second semiconductor substrate; and a electrolyte disposed between the first and second electrodes. The first and second semiconductor substrates are bonded together through bonding pads such that the first and second electrodes are enclosed between the first and second semiconductor substrates. The second conductive material is different from the first conductive material.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: January 19, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chyi-Tsong Ni, I-Shi Wang, Yi Hsun Chiu, Ching-Hou Sue
  • Semiconductor Structures Having a Micro-Battery and Methods for Making the Same
    Publication number: 20140199597
    Abstract: The present disclosure provides an embodiment of an integrated structure that includes a first electrode of a first conductive material embedded in a first semiconductor substrate; a second electrode of a second conductive material embedded in a second semiconductor substrate; and a electrolyte disposed between the first and second electrodes. The first and second semiconductor substrates are bonded together through bonding pads such that the first and second electrodes are enclosed between the first and second semiconductor substrates. The second conductive material is different from the first conductive material.
    Type: Application
    Filed: January 15, 2013
    Publication date: July 17, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chyi-Tsong Ni, I-Shi Wang, Yi Hsun Chiu, Ching-Hou Sue