Patents by Inventor Ching-Hsiang Cheng

Ching-Hsiang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICAL THROUGH WAFER INTERCONNECTS
    Publication number: 20040141421
    Abstract: A wafer with through wafer interconnects. The wafer includes spaced through wafer vias which extend between the back side and front side of the wafer. A conductor within each of said vias connects to front and back side pads. Functions associated with said conductor and said pads provide a depletion region in the wafer between the pads and wafer or pads and conductor and the wafer.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 22, 2004
    Inventors: Ching-Hsiang Cheng, Arif S. Ergun, Butrus T. Khuri-Yakub