Patents by Inventor Ching-Hsiang Hsu Charles

Ching-Hsiang Hsu Charles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for addressable failure site test structure
    Patent number: 6577149
    Abstract: A test structure for detecting defects in a semiconductor wafer and a method for using such test structure are provided. The test structure includes conduction units arranged in an array and test pads connecting to the conduction units. A conduction unit includes closely spaced or intermeshed conduction paths. The test pads are divided into X and Y groups. A pair of test pads X(i), X(i+1) are set to high voltage, a pair of test pads Y(j), Y(j+1) are set to low voltage, and the other test pads are floated. The current I(i, j) flowing from test pad pairs X to Y is measured. If current I(i, j) is a local minimum, then conduction unit (i, j) has a short circuit defect.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: June 10, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yih-Yuh Doong, Jye-Yen Cheng, Ching-Hsiang Hsu Charles
  • Method and device for semiconductor wafer testing
    Publication number: 20020089345
    Abstract: A test structure for detecting defects in a semiconductor wafer and a method for using such test structure are provided. The test structure includes conduction units arranged in an array and test pads connecting to the conduction units. A conduction unit includes closely spaced or intermeshed conduction paths. The test pads are divided into X and Y groups. A pair of test pads X(i), X(i+1) are set to high voltage, a pair of test pads Y(j), Y(j+1) are set to low voltage, and the other test pads are floated. The current I(i,j) flowing from test pad pairs X to Y is measured. If current I(i,j) is a local minimum, then conduction unit (i,j) has a short circuit defect.
    Type: Application
    Filed: January 5, 2001
    Publication date: July 11, 2002
    Inventors: Yih-Yuh Doong, Jye-Yen Cheng, Ching-Hsiang Hsu Charles