Patents by Inventor Ching Hsieh

Ching Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146205
    Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.
    Type: Application
    Filed: September 23, 2023
    Publication date: May 2, 2024
    Inventors: Shin-Li Lin, He-Yi Shu, Shih-Jen Yang, Ta-Yung Yang, Yi-Min Shiu, Chih-Ching Lee, Yu-Chieh Hsieh, Chao-Chi Chen
  • Patent number: 11971565
    Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: April 30, 2024
    Assignees: PTOT (SUZHOU) INC., PLATINUM OPTICS TECHNOLOGY INC.
    Inventors: Chung-Han Lu, Hsiao-Ching Shen, Chun-Cheng Hsieh, Ming-Zhan Wang
  • Publication number: 20240136905
    Abstract: A button mechanism is provided, including a button element, a magnet connected to the button, a hollow tube, a first coil, and a second coil. The first and second coils are disposed on the tube. When the first coil generates a first magnetic field, the magnet is magnetically attracted by the first coil, and the button element is positioned in the first position. When the second coil generates a second magnetic field, the magnet is attracted by the second coil, and the button element is positioned in the second position.
    Type: Application
    Filed: January 13, 2023
    Publication date: April 25, 2024
    Inventors: Chun-Lung CHEN, Chih-Ching HSIEH, Chun-Feng YEH
  • Patent number: 11964366
    Abstract: A socket wrench with a reversible structure includes a rod, a sleeve, a first ratchet block and a second ratchet block. The rod has a columnar surface, and includes a first slot and a second slot. The first slot and the second slot are disposed on different positions along an axis direction of the rod. The sleeve is slidably sleeved on the rod, and includes an accommodating end and a driving end. The accommodating end includes a toothed segment which is protruded radially inward from an inner wall of the accommodating end. The first ratchet block is movably disposed in the first slot and includes a first ratchet portion. The second ratchet block is movably disposed in the second slot and includes a second ratchet portion. The toothed segment of the sleeve is selectively engaged with one of the first ratchet block and the second ratchet block.
    Type: Grant
    Filed: September 12, 2021
    Date of Patent: April 23, 2024
    Assignee: KABO TOOL COMPANY
    Inventor: Chih-Ching Hsieh
  • Publication number: 20240128009
    Abstract: A magnetic device includes a magnetic core and at least two windings. The magnetic core includes an annular main body and a hollow portion. Each of the at least two windings includes a coil with a plurality of turns. Each turn of the coil penetrates through the hollow portion and is disposed around the annular main body. The at least two windings are disposed around the annular main body to form at least three winding regions. Each of the winding regions except a winding region which is last formed has at least three winding layers stacked up one by one. The number of the winding layers of the winding regions except the winding region which is last formed is odd and greater than or equal to three.
    Type: Application
    Filed: January 12, 2023
    Publication date: April 18, 2024
    Inventors: Meng-Chen Hsieh, Chun-Ching Yen, Huai-Pei Tung
  • Patent number: 11955154
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
  • Publication number: 20240114545
    Abstract: A method, a wireless modem and a mobile device for wireless communication are provided. The method for wireless communication includes: judging a plurality of service types for a plurality of cells; judging a plurality of gears for each of the service types; obtaining a customization favor setting; obtaining a plurality of weighted priority values for the plurality of cells according to the plurality of service types and the customization favor setting; obtaining a plurality of weighted signal quality values for the plurality of cells according to the plurality of service types, the plurality of gears for each of the plurality of service types and the customization favor setting; in an idle mode, triggering mobility via cell reselection which uses the weighted priority values or the weighted signal quality values; and in a connected mode, triggering mobility via measurement reports which are generated based on the weighted signal quality values.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 4, 2024
    Inventors: Yu-Ting SUN, Wan-Ting HUANG, I-Ching HSIEH
  • Patent number: 11949001
    Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Ching Wang, Chung-I Yang, Jon-Hsu Ho, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
  • Patent number: 11942130
    Abstract: A bottom-pinned spin-orbit torque magnetic random access memory (SOT-MRAM) is provided in the present invention, including a substrate, a bottom electrode layer on the substrate, a magnetic tunnel junction (MTJ) on the bottom electrode layer, a spin-orbit torque (SOT) layer on the MTJ, a capping layer on the SOT layer, and an injection layer on the capping layer, wherein the injection layer is divided into individual first part and second part, and the first part and the second part are connected respectively with two ends of the capping layer.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jian-Jhong Chen, Yi-Ting Wu, Jen-Yu Wang, Cheng-Tung Huang, Po-Chun Yang, Yung-Ching Hsieh
  • Publication number: 20240071847
    Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Yi-Huan Liao, Ping-Yin Hsieh, Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
  • Patent number: 11916110
    Abstract: Embodiments of the present disclosure provide a method for forming semiconductor device structures. The method includes forming a fin structure having a stack of semiconductor layers comprising first semiconductor layers and second semiconductor layers alternatingly arranged, forming a sacrificial gate structure over a portion of the fin structure, removing the first and second semiconductor layers in a source/drain region of the fin structure that is not covered by the sacrificial gate structure, forming an epitaxial source/drain feature in the source/drain region, removing portions of the sacrificial gate structure to expose the first and second semiconductor layers, removing portions of the second semiconductor layers so that at least one second semiconductor layer has a width less than a width of each of the first semiconductor layers, forming a conformal gate dielectric layer on exposed first and second semiconductor layers, and forming a gate electrode layer on the conformal gate dielectric layer.
    Type: Grant
    Filed: July 4, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Ching Wang, Wei-Yang Lee, Ming-Chang Wen, Jo-Tzu Hung, Wen-Hsing Hsieh, Kuan-Lun Cheng
  • Publication number: 20240051592
    Abstract: A handle structure of a trolley contains: two grips symmetrically mounted on the trolley, and a respective one grip includes: a first fixing portion, a second fixing portion, and a body. The first fixing portion is configured to be connected with the trolley. The second fixing portion is configured to be connected with the trolley and located below the first fixing portion. The first fixing portion and the second fixing portion are on an axial line. The body is defined between the first fixing portion and the second fixing portion, a first end of the body is connected with an outer side of the first fixing portion, and a second end of the body is connected with a rear side of the second fixing portion; the body includes a first extending portion, a first connection portion, a second extending portion, a second connection portion, and a third extending portion.
    Type: Application
    Filed: August 11, 2023
    Publication date: February 15, 2024
    Inventor: HUNG-CHING HSIEH
  • Patent number: 11897092
    Abstract: The present invention provides a cover plate structure of ratchet wrench comprising: a main body, inside a head portion thereof has an accommodating space, a peripheral wall is formed in the accommodating space, and the accommodating space is formed with at least one opening; a ratchet mechanism provided in the accommodating space; a cover plate having a cover portion and a snap-abut portion, the cover plate is placed in the opening of the accommodating space, and the snap-abut portion is stuck against the peripheral wall of the accommodating space. an elastic fastener member is disposed between the head portion and the cover plate, the fastener member applies an elastic force to the cover plate, so that the snap-abut portion of the cover plate elastically snaps against the peripheral wall of the accommodating space. The cover plate is capable of bearing the load during operation, increasing the withstand strength of the head portion.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: February 13, 2024
    Assignee: KABO TOOL COMPANY
    Inventor: Chih-Ching Hsieh
  • Patent number: 11903325
    Abstract: A memory device includes a substrate; an active area extending along a first direction on the substrate; a gate line traversing the active area and extending along a second direction that is not parallel to the first direction; a source doped region in the active area and on a first side of the gate line; a main source line extending along the first direction; a source line extension coupled to the main source line and extending along the second direction; a drain doped region in the active area and on a second side of the gate line that is opposite to the first side; and a data storage element electrically coupled to the drain doped region. The main source line is electrically connected to the source doped region via the source line extension.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: February 13, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Ting Wu, Yan-Jou Chen, Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yung-Ching Hsieh, Jian-Jhong Chen, Bo-Chang Li
  • Patent number: 11845165
    Abstract: A tubular body for an electronic torque wrench is integrally formed and includes a small diameter portion, a bridge portion, and a large diameter portion connected along the longitudinal direction of the tubular body. The bridge portion has a small diameter end connected to the rear end of the small diameter portion and an opposite large diameter end connected to the front end of the large diameter portion. As there is no gap at the junction between the large diameter portion and the small diameter portion, the tubular body is dustproof, has a lower production cost and higher structural strength, and makes an electronic torque wrench a better appearance.
    Type: Grant
    Filed: August 3, 2019
    Date of Patent: December 19, 2023
    Assignee: KABO TOOL COMPANY
    Inventor: Chih-Ching Hsieh
  • Publication number: 20230364754
    Abstract: An elastic element includes an inner annular wall, at least one outer annular wall, and a groove. The at least one outer annular wall connects with the inner annular wall and surrounds the inner annular wall. The groove is formed between the inner annular wall and the at least one outer annular wall. The structural designs of the inner annular wall, the at least one outer annular wall, and the groove are such that when the elastic element is applied to a hand tool, the groove provides a space that allows the inner annular wall to be deformed, making it easier for a user to fit a to-be-operated object securely in the hand tool to enhance work efficiency.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 16, 2023
    Inventor: Chih-Ching Hsieh
  • Publication number: 20230364753
    Abstract: A socket includes a body, a through hole, an accommodating base and an abutting element. The body includes an outer wall and an operating inner surface. The operating inner surface surrounds an operating space, and the operating space is configured for a tool to insert therein. The through hole penetrates the outer wall and the operating inner surface radially, and the through hole is communicated with the operating space. The accommodating base is accommodated in the through hole and includes a bottom portion and a surrounding wall. The bottom portion is located at an outer end of the through hole and covers the through hole. The surrounding wall is connected to the bottom portion and located in the through hole. The surrounding wall and the bottom portion surround an accommodating space. The abutting element is disposed in the accommodating space.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 16, 2023
    Inventor: Chih-Ching HSIEH
  • Publication number: 20230343379
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Application
    Filed: May 16, 2022
    Publication date: October 26, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
  • Patent number: 11780064
    Abstract: A socket structure includes a body, a first fitting hole, a second fitting hole, and at least one elastic engaging member. The first fitting hole is disposed at one end of the body. The second fitting hole is disposed at another end of the body. The at least one elastic engaging member is disposed in the first fitting hole and protrudes toward an inner portion of the first fitting hole along a radial direction of the first fitting hole. When a tool is inserted into the first fitting hole, the at least one elastic engaging member is pressed and deformed by the tool and is thus engaged with the tool. The configuration of the at least one elastic engaging member makes it easier to connect a tool to and remove the tool from the socket structure.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: October 10, 2023
    Assignee: KABO Tool Company
    Inventor: Chih-Ching Hsieh
  • Patent number: D1024708
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: April 30, 2024
    Assignee: KABO Tool Company
    Inventor: Chih-Ching Hsieh