Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.

Abstract: A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.

Abstract: A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.

Abstract: An exemplary insert-molded cover (10) for electronic devices includes a metallic body (11), a plastic antenna lid (12) integrally formed with the metallic body and an oxide film (12) formed on a surface (111) of the metallic body for attaching the plastic antenna lid. The present invention also relates a method for manufacturing the insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for electronic devices. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed with the metallic body. The metallic body includes a joining area (13) on an edge of the metallic body, the plastic antenna lid includes at least two portions (12a, 12b) formed in the joining area correspondingly. The present invention also relates to a method for manufacturing an insert-molded cover for electronic devices.

Abstract: An exemplary insert-molded cover (10) for electronic devices includes a metallic body (11), a plastic antenna lid (12) integrally formed with the metallic body and an oxide film (12) formed on a surface (111) of the metallic body for attaching the plastic antenna lid. The present invention also relates a method for manufacturing the insert-molded cover for electronic devices.

Abstract: An exemplary joining structure, used for insert-molded covers, includes a metallic portion (131), a plastic portion (132) integrally formed with the metallic portion, and an adhesive film (133) formed between the metallic portion and the plastic portion. The metallic portion and the plastic portion are bonded together by the adhesive film. The present invention also relates an insert-molded cover (10) for electronic devices using the joining structure and a method for manufacturing the insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for a electronic device. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed on an edge of the metallic body. At least one latching structure (13, 14, 15, 16) is formed on a boundary of the metallic body and the plastic antenna lid. The present invention also relates a method for manufacturing an insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for a electronic device. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed on an edge of the metallic body. An outer surface (101) of a junction of the metallic body and the plastic antenna lid is smooth and painted by a coating (13). The present invention also relates a method for manufacturing an insert-molded cover for electronic devices.

Abstract: An apparatus for calculating an N-point Discrete Fourier Transforms (DFTs) and/or Inverse DFTs (IDFTs) using the Cooley-Tukey algorithm is provided. The N-point DFT/IDFT is achieved by calculating a plurality of N1-point and N2-point DFTs. The apparatus comprises a storing unit, a calculating unit, and a controlling unit. The storing unit comprises a first memory for storing a plurality of first data and a second memory for storing a plurality of second data. The calculating unit comprises a one-dimensional systolic array for calculating the N1-point and N2-point DFT.