Patents by Inventor Ching-Hsien Chen
Ching-Hsien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260053750Abstract: The present disclosure describes a formulation for the delivery of CDK9 inhibitors.Type: ApplicationFiled: August 17, 2023Publication date: February 26, 2026Inventors: Matthew OWEN, Tom YARBROUGH, Dominik HAUDENSCHILD, Jasper YIK, Gang-Yu LIU, Ching-Hsien CHEN, Reen WU, Lark COFFEY, Mei-chang KUO
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Patent number: 12508765Abstract: A thermoforming pipe-shaping machine includes a chassis, an electric machine control assembly beside the chassis, a push unit arranged on the chassis, a rotation unit arranged on the push unit, a clamp unit arranged on the push unit, a heating and forming unit arranged on the chassis, and a clip unit at one end side of the chassis. The rotation unit receives a shaping bar on which a Teflon pipe is sleeved to fit therein. The shaping bar includes one end threaded portion. The rotation unit drives the shaping bar to rotate. The push unit drives the rotation unit to slide on the chassis. The clamp unit clamps the shaping bar carrying the Teflon pipe. The heating and forming unit performs an operation of heating and pressing on the threaded portion of the shaping bar carrying the Teflon pipe to shape the Teflon pipe into a spiral form.Type: GrantFiled: July 10, 2024Date of Patent: December 30, 2025Assignee: SHIN YUEH APPLIED MATERIALS CO., LTD.Inventors: Ming-Hsien Chang, Ching-Hsien Chen
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Publication number: 20220267390Abstract: This disclosure provides an isolated polypeptide therapeutics, polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.Type: ApplicationFiled: May 15, 2020Publication date: August 25, 2022Inventors: Reen Wu, Ching-Hsien Chen, David C. Yang
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Patent number: 11007248Abstract: This disclosure relates to compositions of isolated polypeptides and methods of their use for the treatment and prevention of disease or disease symptoms associated with MARCKS phosphorylation and/or dissociation from the cell membrane, including but not limited to allergic inflammation, asthma, chronic bronchitis, COPD, infection, hyper-reactivity, cystic fibrosis, ulcerative colitis, Crohn's disease, irritable bowel syndrome, rosacea, eczema, psoriasis, acne, arthritis, rheumatoid arthritis, psoriatic arthritis, and systemic lupus erythematosus.Type: GrantFiled: April 25, 2019Date of Patent: May 18, 2021Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
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Publication number: 20210087247Abstract: This disclosure provides an isolated polypeptide comprising no more than 35 amino acids, wherein the amino acid sequence comprises, or alternatively consists essentially of, or alternatively consisting of XXXRYSYXXSYX (SEQ ID NO: 1) and equivalents thereof, wherein X is a basic amino acid and Y is a hydrophobic amino acid. Polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.Type: ApplicationFiled: January 28, 2019Publication date: March 25, 2021Inventors: Reen Wu, Ching-Hsien Chen
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Publication number: 20200206308Abstract: This disclosure relates to compositions of isolated polypeptides and methods of their use for the treatment and prevention of disease or disease symptoms associated with MARCKS phosphorylation and/or dissociation from the cell membrane, including but not limited to allergic inflammation, asthma, chronic bronchitis, COPD, infection, hyper-reactivity, cystic fibrosis, ulcerative colitis, Crohn's disease, irritable bowel syndrome, rosacea, eczema, psoriasis, acne, arthritis, rheumatoid arthritis, psoriatic arthritis, and systemic lupus erythematosus.Type: ApplicationFiled: April 25, 2019Publication date: July 2, 2020Inventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
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Patent number: 10314889Abstract: This disclosure relates to compositions of isolated polypeptides and methods of their use for the treatment and prevention of disease or disease symptoms associated with MARCKS phosphorylation and/or dissociation from the cell membrane, including but not limited to allergic inflammation, asthma, chronic bronchitis, COPD, infection, hyper-reactivity, cystic fibrosis, ulcerative colitis, Crohn's disease, irritable bowel syndrome, rosacea, eczema, psoriasis, acne, arthritis, rheumatoid arthritis, psoriatic arthritis, and systemic lupus erythematosus.Type: GrantFiled: December 19, 2014Date of Patent: June 11, 2019Assignee: The Regents of the University of CaliforniaInventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
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Patent number: 10189881Abstract: This disclosure provides an isolated polypeptide comprising no more than 35 amino acids, wherein the amino acid sequence comprises, or alternatively consists essentially of, or alternatively consisting of XXXRYSYXXSYX (SEQ ID NO: 1) and equivalents thereof, wherein X is a basic amino acid and Y is a hydrophobic amino acid. Polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.Type: GrantFiled: July 25, 2014Date of Patent: January 29, 2019Assignee: The Regents of the University of CaliforniaInventors: Reen Wu, Ching-Hsien Chen
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Publication number: 20170028019Abstract: This disclosure compositions and methods for the treatment and prevention of allergic inflammation and diseases associated with such, e.g., asthma.Type: ApplicationFiled: December 19, 2014Publication date: February 2, 2017Applicant: The Regents of the University of CaliforniaInventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
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Publication number: 20160176936Abstract: This disclosure provides an isolated polypeptide comprising no more than 35 amino acids, wherein the amino acid sequence comprises, or alternatively consists essentially of, or alternatively consisting of XXXRYSYXXSYX (SEQ ID NO: 1) and equivalents thereof, wherein X is a basic amino acid and Y is a hydrophobic amino acid. Polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.Type: ApplicationFiled: July 25, 2014Publication date: June 23, 2016Inventors: Reen Wu, Ching-Hsien Chen
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Patent number: 9110386Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.Type: GrantFiled: June 10, 2014Date of Patent: August 18, 2015Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jen-Pan Wang, Chien-Hsuan Liu, Ching-Hsien Chen, Chao-Chi Chen
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Publication number: 20140293250Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.Type: ApplicationFiled: June 10, 2014Publication date: October 2, 2014Inventors: Jen-Pan WANG, Chien-Hsuan LIU, Ching-Hsien CHEN, Chao-Chi CHEN
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Patent number: 8772054Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.Type: GrantFiled: September 8, 2011Date of Patent: July 8, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jen-Pan Wang, Chien-Hsuan Liu, Ching-Hsien Chen, Chao-Chi Chen
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Publication number: 20130065328Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.Type: ApplicationFiled: September 8, 2011Publication date: March 14, 2013Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jen-Pan WANG, Chien-Hsuan Liu, Ching-Hsien Chen, Chao-Chi Chen
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Patent number: 7062342Abstract: A system for automatically receiving, verifying, and processing a request of a fabricating organization for manufacture of a product executes a method for verifying a request of a fabricating organization for manufacture of a product begins by receiving the request for manufacture of the product from a design organization. An acknowledgement of the request is generated and transferred to the design organization. The request is then verified that a format and syntax of the request complies with requirements for format and syntax of the request as established by the fabricating organization. If the format and syntax does not comply with the requirements for the format and syntax, the request is rejected for manufacture. However, if the format and syntax has minor non-compliances to the requirements for format and syntax, the minor non-compliances are corrected such that the request is in compliance to the requirements for format and syntax.Type: GrantFiled: May 24, 2002Date of Patent: June 13, 2006Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shu-Ling Feng, Ching-Hsien Chen