Patents by Inventor Ching-Hsin Chang

Ching-Hsin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134279
    Abstract: A photoresist includes a solvent, a polymer and an additive. The polymer is dissolved in the solvent, and the additive is dispersed in the solvent. The additive includes a double bond or includes an epoxy group. The additive has a surface tension different from a surface tension of the polymer.
    Type: Application
    Filed: March 27, 2023
    Publication date: April 25, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Publication number: 20240096623
    Abstract: A method of manufacturing a semiconductor device includes forming a first layer comprising an organic material over a substrate. A second layer is formed over the first layer, wherein the second layer includes a silicon-containing material and one or more selected from the group consisting of a photoacid generator, an actinic radiation absorbing additive including an iodine substituent, and a silicon-containing monomer having iodine or phenol group substituents. A photosensitive layer is formed over the second layer, and the photosensitive layer is patterned.
    Type: Application
    Filed: March 17, 2023
    Publication date: March 21, 2024
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Patent number: 11914301
    Abstract: A photoresist includes a polymer and a photoactive compound. The photoactive compound contains a sensitizer component. The photoactive compound contains an acid generator or a base molecular. The acid generator or the base molecular bonds the sensitizer component. The photoactive compound is within a polymer backbone. The sensitizer component is configured to absorb an EUV light to produce electrons.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Hsin Hsieh, Wei-Han Lai, Ching-Yu Chang
  • Publication number: 20150240356
    Abstract: An inlet system for a metal-organic chemical vapor deposition (MOCVD) apparatus is provided. The inlet system includes an inlet module and a subsidiary inlet module. The inlet module admits a reactant gas. The subsidiary inlet module admits a carrier gas. The subsidiary inlet module is disposed outside the inlet module to reduce turbulent flow, prevent the reactant gas from contaminating the inner wall of a reactor chamber, and concentrate the reactant gas, so as to enhance the reaction rate of the reactant gas and the growth rate of films.
    Type: Application
    Filed: April 14, 2014
    Publication date: August 27, 2015
    Applicant: National Central University
    Inventors: Jyh-Chen CHEN, Ching-Hsin CHANG
  • Patent number: 9097972
    Abstract: A method comprises dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on the first layer of high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: August 4, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Chen Lin, Ching-Hsin Chang, Chia-Hung Chu, Hu-Wei Lin, Chih-Hsien Hsu, Hong-Hsing Chou
  • Patent number: 8960560
    Abstract: An electronic tag capable of coupling to metal can be attached to the metallic surface of a product, and includes a substrate, a radiation body arranged on a surface of the substrate, a grounding body and a reference line. The grounding body is also arranged on the aforementioned surface and electrically connects to the radiation body. The reference line is arranged on the aforementioned surface and in the grounding body. While such electronic tag is attached to the metallic surface of a product, a portion of the grounding body, which is opposite to the radiation body, contacts with such metallic surface, so that the signal reading distance of such electronic tag can be broadened and extended in virtue of coupling such grounding body with such metallic surface to cause the grounding area to be enlarged. The extent of such contact shall not extend beyond such reference line.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: February 24, 2015
    Assignee: Favite Inc.
    Inventors: Hung-Tuan Hsieh, Ching-Hsin Chang, Kun-Jen Huang
  • Publication number: 20140210057
    Abstract: A method comprises dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on the first layer of high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate.
    Type: Application
    Filed: January 29, 2013
    Publication date: July 31, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Chen Lin, Ching-Hsin Chang, Chia-Hung Chu, Hu-Wei Lin, Chih-Hsien Hsu, Hong-Hsing Chou
  • Patent number: 8445070
    Abstract: A biodegradable waterproof paper coated with PLA film and the manufacturing method for the same are disclosed. The biodegradable waterproof paper includes a PLA film on at least one surface of the paper and the PLA film partially infiltrates into the fibers of the paper.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: May 21, 2013
    Assignee: Wei Mon Industry Co., Ltd.
    Inventors: Ching-Hsin Chang, Wen-Chih Wu
  • Publication number: 20120010311
    Abstract: A biodegradable two-liquid type foaming composition, which comprises main liquid and auxiliary liquid, is disclosed. The main liquid is formed by mixing polylactic acid powder, polycaprolactone polyol and foaming agent. The auxiliary liquid is formed by mixing polyol and isocyanate. Once the main liquid and the auxiliary liquid are mixed, the foaming reaction proceeds and the biodegradable foam is formed.
    Type: Application
    Filed: March 17, 2010
    Publication date: January 12, 2012
    Applicant: WEI MON INDUSTRY CO., LTD.
    Inventors: Ching-Hsin Chang, Wen-Chih Wu
  • Publication number: 20100323212
    Abstract: A biodegradable waterproof paper coated with PLA film and the manufacturing method for the same are disclosed. The biodegradable waterproof paper includes a PLA film on at least one surface of the paper and the PLA film partially infiltrates into the fibers of the paper.
    Type: Application
    Filed: January 15, 2009
    Publication date: December 23, 2010
    Applicant: WEI MON INDUSTRY CO., LTD.
    Inventors: Ching-Hsin Chang, Wen-Chih Wu