Abstract: The invention relates to a water-based ceramic three-dimensional laminate material and a method for using the same material to manufacture the ceramic objects, comprising: a step Sa of preparing a plurality of projected slice graphics and a slurry, wherein the projected slice graphics are formed by slicing a three-dimensional image along a specific direction with a specific thickness, the slurry is prepared by mixing the material powder, the photo-curing resin, the solvent and the additive; a step Sb of uniformly laying the slurry on the substrate to form a sacrificial layer; and a step Sc of uniformly laying the slurry on the slurry to form a reaction layer on the sacrificial layer; a step Sd of irradiating the reaction layer with a light beam according to one of the plurality of projected slice graphics, and the slurry is cured after being irradiated; a step Se of repeating steps Sc and Sd until a ceramic body is formed; a step Sf of washing the ceramic body with water or an organic solvent; and a step Sg o

Abstract: An image detection system includes a rod body having a detection terminal and a control terminal, and at least one fixing unit fixed at the rod body; a movement module, provided between the detection terminal and the control terminal; and a detection module, provided at the detection terminal of the rod body, the detection module comprising a plurality of imaging units, a detection unit and a control unit, wherein the imaging units are arranged at the detection terminal in a manner of surrounding the rod body, the imaging units obtain images inside the hole or the tube, the movement module moves the body inside the hole or the tube, and the detection unit obtains size and position information of a detection target, thereby achieving detection and measurement of damaged holes or cracks inside a hole or a tube, or conditions inside the hole or the tube.

Abstract: The invention relates to a water-based ceramic three-dimensional laminate material and a method for using the same material to manufacture the ceramic objects, comprising: a step Sa of preparing a plurality of projected slice graphics and a slurry, wherein the projected slice graphics are formed by slicing a three-dimensional image along a specific direction with a specific thickness, the slurry is prepared by mixing the material powder, the photo-curing resin, the solvent and the additive; a step Sb of uniformly laying the slurry on the substrate to form a sacrificial layer; and a step Sc of uniformly laying the slurry on the slurry to form a reaction layer on the sacrificial layer; a step Sd of irradiating the reaction layer with a light beam according to one of the plurality of projected slice graphics, and the slurry is cured after being irradiated; a step Se of repeating steps Sc and Sd until a ceramic body is formed; a step Sf of washing the ceramic body with water or an organic solvent; and a step Sg o

Abstract: Fabricating a dual-trench alternating phase shift mask (PSM) is disclosed. A chromium layer over a quartz layer of the PSM is patterned according to a semiconductor design. The quartz layer is dry etched a first number of times through a first photoresist layer applied over the chromium layer and patterned according to the deep trenches of the alternating PSM design by using beam writing. This initially forms deep trenches of the PSM. The quartz layer is dry etched a second number of times through a second photoresist layer applied over the chromium layer and patterned according to the deep trenches and the shallow trenches of the alternating PSM design by using backside ultraviolet exposure. This completely forms shallow trenches and the deep trenches of the PSM. The second photoresist layer is then removed.

Abstract: Fabricating a dual-trench alternating phase shift mask (PSM) is disclosed. A chromium layer over a quartz layer of the PSM is patterned according to a semiconductor design. The quartz layer is dry etched a first number of times through a first photoresist layer applied over the chromium layer and patterned according to the deep trenches of the alternating PSM design by using beam writing. This initially forms deep trenches of the PSM. The quartz layer is dry etched a second number of times through a second photoresist layer applied over the chromium layer and patterned according to the deep trenches and the shallow trenches of the alternating PSM design by using backside ultraviolet exposure. This completely forms shallow trenches and the deep trenches of the PSM. The second photoresist layer is then removed.