Patents by Inventor Ching-Hsing Liao

Ching-Hsing Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-dissipating module and assembled structure of heat-dissipating module and integrated circuit chipset
    Patent number: 8687368
    Abstract: An assembled structure includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module includes a heat sink, a locking member and at least one elastic element. The heat sink includes a base and a plurality of fins. The locking member includes a rectangular frame with at least one sustaining part. Two first lateral plates are downwardly extended from a first side and a second side of the rectangular frame, respectively. The first side and the second side are opposed to each other. In addition, at least one hook is formed on an inner surface and a lower edge of each first lateral plate. The elastic element has a first part sustained against the base of the heat sink and a second part sustained against the sustaining part of the rectangular frame. The hooks are engaged with a bottom surface of the substrate of the integrated circuit chipset.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: April 1, 2014
    Assignee: Enzotechnology Corp.
    Inventors: Chen-Chang Wu, Ching-Hsing Liao
  • HEAT-DISSIPATING MODULE AND ASSEMBLED STRUCTURE OF HEAT-DISSIPATING MODULE AND INTEGRATED CIRCUIT CHIPSET
    Publication number: 20120327605
    Abstract: An assembled structure includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module includes a heat sink, a locking member and at least one elastic element. The heat sink includes a base and a plurality of fins. The locking member includes a rectangular frame with at least one sustaining part. Two first lateral plates are downwardly extended from a first side and a second side of the rectangular frame, respectively. The first side and the second side are opposed to each other. In addition, at least one hook is formed on an inner surface and a lower edge of each first lateral plate. The elastic element has a first part sustained against the base of the heat sink and a second part sustained against the sustaining part of the rectangular frame. The hooks are engaged with a bottom surface of the substrate of the integrated circuit chipset.
    Type: Application
    Filed: August 3, 2011
    Publication date: December 27, 2012
    Applicant: ENZOTECHNOLOGY CORP.
    Inventors: Chen-Chang Wu, Ching-Hsing Liao