Abstract: A manufacturing method of an interconnect structure including the following is provided. A substrate is provided. Sacrificial layers are formed on the substrate. A dielectric layer is formed between two adjacent sacrificial layers. There is an air gap in the dielectric layer. The sacrificial layers are removed to form first openings. A conductive layer is formed in the first opening.

Abstract: A manufacturing method of an interconnect structure including the following is provided. A substrate is provided. Sacrificial layers are formed on the substrate. A dielectric layer is formed between two adjacent sacrificial layers. There is an air gap in the dielectric layer. The sacrificial layers are removed to form first openings. A conductive layer is formed in the first opening.

Abstract: First, a spin-on process is performed for forming a first dielectric layer over a plurality of metal interconnecting wires that are located on a semiconductor wafer. Then, an examining step is performed on the first dielectric layer, and the first dielectric layer is made to conform to a predetermined condition. Thereafter, an etching process is performed for completely removing the first dielectric layer. Subsequently, the semiconductor wafer is cleaned through use of a wet scrubber, and is dried. Finally, the spin-on process is re-performed for forming a second dielectric layer on the semiconductor wafer.

Abstract: First, a spin-on process is performed for forming a first dielectric layer over a plurality of metal interconnecting wires that are located on a semiconductor wafer. Then, an examining step is performed on the first dielectric layer, and the first dielectric layer is made to conform to a predetermined condition. Thereafter, an etching process is performed for completely removing the first dielectric layer. Subsequently, the semiconductor wafer is cleaned through use of a wet scrubber, and is dried. Finally, the spin-on process is re-performed for forming a second dielectric layer on the semiconductor wafer.

Abstract: A hard disk case mounting structure includes an auxiliary stop bar provided at either side of a front end of a hard disk frame for preventing a pull handle on a case of the hard disk frame from being forcefully pulled up, thereby protecting the hard disk lock. Besides, the relative movement between the pull handle and the auxiliary stop bar may result in a counter force between the case and a mounting frame to cause two connecting ports to be separated to permit smooth removal of the hard disk.

Abstract: A drawer type hard diskdrive box assembly is described. The assembly includes a mounting frame, a casing covered with a cover frame and slidably mounted in the mounting frame to hold the diskdrive and a handle pivoted to the front side of the casing for carrying the same. The mounting frame has a spring latch for locking the handle when the casing is locked in the mounting frame and a movable dust board which is operative to close the mounting frame when the casing is removed from the mounting frame. The handle also has two pins at opposite ends which are stopped against stop edges of the mounting frame to force the casing outwards from the mounting frame when the handle is turned counter clockwise relative to the casing.