Abstract: A cavity-down multiple-chip package mainly includes a heat spreader, a circuit substrate with an opening, a chip, and at least one electronic element; wherein an upper surface of the circuit substrate defines at least one element mounting area; the heat spreader is disposed on said upper surface of the circuit substrate; and the element mounting area is exposed for disposing these electronic elements. A cavity is formed by the opening of the circuit substrate and the heat spreader and is used for accommodating the chip. A plurality of solder balls can be disposed on a lower surface of the circuit substrate.

Abstract: A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat spreader is mounted on the back surface of the semiconductor chip. Therein the universal heat spreader has a plurality of through holes for upgrading the efficiency of heat transmission. Moreover, a heat transmission pin is provided in one of the through holes to increase the areas for heat dissipation so as to enhance the thermal performance of the package.

Abstract: A cavity-down thermally enhanced package mainly comprises a heat spreader, a thermally conductive metal ring, a circuit substrate and a chip. The circuit substrate is attached to a receiving surface of the heat spreader, and has an opening for exposing part of the receiving surface. The thermally conductive metal ring and the chip are disposed within the opening. The chip is attached to the receiving surface of the heat spreader, and the thermally conductive metal ring protrudes from the receiving surface of the heat spreader and is located between a side surface of the chip and an inner lateral wall of the circuit substrate, for improving the heat dissipating efficiency and the electrical shielding effect of the chip.

Abstract: A high heat dissipation flip chip package structure including a substrate, a chip, a supporting structure, and a heat spreader is provided. The substrate has a substrate surface. The chip has an active surface with several bumps formed thereon. The bumps are connected to the substrate surface. The supporting structure has an upper part having a first opening and a lower part fixed on the substrate surface. The first opening corresponds to the chip. The heat spreader having at least a second opening is fixed on the upper part. The first opening is connected to outside through the second opening. The heat generated by the chip is not only dissipated to outside through the heat spreader by the heat conduction, but also dissipated to outside by the heat convection at the first opening and the second opening.

Abstract: A cavity-down multiple-chip package mainly comprises a heat spreader, a circuit substrate with an opening, a chip, and at least one electronic element; wherein an upper surface of the circuit substrate defines at least one element mounting area; the heat spreader is disposed on said upper surface of the circuit substrate; and the element mounting area is exposed for disposing these electronic elements. A cavity is formed by the opening of the circuit substrate and the heat spreader and is used for accommodating the chip. A plurality of solder balls can be disposed on a lower surface of the circuit substrate.

Abstract: A flip chip package with a thermometer comprises a chip, a substrate, and a thermocouple. The chip has an active surface and a plurality of bumps disposed on the active surface. The substrate defines a region for disposing the chip, and comprises a plurality of bump pads disposed on the region, corresponding to the bumps, and electrically connected to the bumps. Each of the thermocouples comprises a thermal contact which is disposed between the substrate and one of the bumps of the chip.

Abstract: A cavity-down semiconductor package mainly includes a heat spreader, a substrate, and a chip. The substrate has an outer surface, an inner surface opposing to the outer surface and an opening passing through the outer and inner surfaces. The inner surface is attached to the heat spreader to form a chip carrier with a chip cavity. The chip is located in the opening and electrically connected to the substrate. The substrate includes a metal cover layer over the inner surface. The metal cover layer can be bonded to the heat spreader to establish a thermal-coupling relationship to improve adhesion, heat conductibility and electrical performance between the substrate and the heat spreader.

Abstract: A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat spreader is mounted on the back surface of the semiconductor chip. Therein the universal heat spreader has a plurality of through holes for upgrading the efficiency of heat transmission. Moreover, a heat transmission pin is provided in one of the through holes to increase the areas for heat dissipation so as to enhance the thermal performance of the package.

Abstract: A flip chip package with a thermometer comprises a chip, a substrate, and a thermal couple. The chip has an active surface and a plurality of bumps disposed on the active surface. The substrate defines a region for disposing the chip, and comprises a plurality of bump pads disposed on the region, corresponding to the bumps, and electrically connected to the bumps. Each of the thermal couples comprises a thermal contact which is disposed between the substrate and one of the bumps of the chip.