Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: Methods of manufacturing a semiconductor structure are provided. One of the methods includes: receiving a substrate including a first conductive region of a first transistor and a second conductive region of a second transistor, wherein the first transistor and the second transistor have different conductive types; performing an amorphization on the first conductive region and the second conductive region; performing an implantation over the first conductive region of the first transistor; forming a contact material layer over the first conductive region and the second conductive region; performing a thermal anneal on the first conductive region and the second conductive region; and performing a laser anneal on the first conductive region and the second conductive region.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: A probe card includes a space transformer, a printed circuit board and a plurality of welding elements. The space transformer is disposed with a plurality of first conductive protrusions. Each of the first conductive protrusions has a first end surface. The printed circuit board is disposed with a plurality of second conductive protrusions. Each of the second conductive protrusions has a second end surface. The welding elements are respectively and electrically connected between each of the second end surfaces and the corresponding first end surface. A first surface of the space transformer away from the printed circuit board has a first degree of flatness. A second surface of the printed circuit board away from the space transformer has a second degree of flatness. The first degree of flatness is less than the second degree of flatness.

Abstract: A fan frame of a centrifugal fan comprises a housing and an inlet structure. The housing includes an opening. The inlet structure is disposed at the opening and includes a top portion and an edge portion. The top portion is disposed around the opening and includes a plurality of first chamfering angles, at least one of the chamfering angles is different from the others. The edge portion extends from the top portion to the inside of the housing through the opening and includes a plurality of second chamfering angles. A centrifugal fan including the fan frame is also disclosed.

Abstract: A fan frame of a centrifugal fan comprises a housing and an inlet structure. The housing includes an opening. The inlet structure is disposed at the opening and includes a top portion and an edge portion. The top portion is disposed around the opening and includes a plurality of first chamfering angles, at least one of the chamfering angles is different from the others. The edge portion extends from the top portion to the inside of the housing through the opening and includes a plurality of second chamfering angles. A centrifugal fan including the fan frame is also disclosed.

Abstract: An LED lamp including a lamp housing, an LED light source, a heat sink and a control circuit. The lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, wherein the accommodating space joins an environment through the air inlets and the air outlets. The LED light source and the heat sink are disposed in the accommodating space and the heat sink is connected with the LED light source. The heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. An air convection channel is located between any two adjacent heat dissipation fins. Air from the environment flows into the accommodating space, passes through the air convection channel, and leaves the accommodating space via the air outlets sequentially. The control circuit is disposed in the accommodating space and connected to the LED light source.

Abstract: An LED lamp including a lamp housing, an LED light source, a heat sink and a control circuit. The lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, wherein the accommodating space joins an environment through the air inlets and the air outlets. The LED light source and the heat sink are disposed in the accommodating space and the heat sink is connected with the LED light source. The heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. An air convection channel is located between any two adjacent heat dissipation fins. Air from the environment flows into the accommodating space, passes through the air convection channel, and leaves the accommodating space via the air outlets sequentially. The control circuit is disposed in the accommodating space and connected to the LED light source.