Patents by Inventor Ching-Huang Shen

Ching-Huang Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11858089
    Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: January 2, 2024
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Publication number: 20200047307
    Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Patent number: 10478940
    Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 19, 2019
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Publication number: 20180009080
    Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.
    Type: Application
    Filed: June 28, 2017
    Publication date: January 11, 2018
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang