Patents by Inventor Ching-Hui Hung

Ching-Hui Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection structure for semiconductor package
    Patent number: 9013042
    Abstract: An interconnection structure for being formed on bonding pads of a substrate in a semiconductor package is provided. The interconnection structure includes a nickel layer formed on each of the bonding pads, a metal layer formed on the nickel layer, and a solder material formed on the metal layer. The metal layer is made of one of gold, silver, lead and copper, and has a thickness in the range of 0.5 to 5 um. As such, when the solder material is reflowed to form solder bumps, no nickel-tin compound is formed between the solder bumps and the metal layer, thereby avoiding cracking or delamination of the solder bumps.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: April 21, 2015
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chang-Fu Lin, Ho-Yi Tsai, Chin-Tsai Yao, Jui-Chung Ho, Ching-Hui Hung
  • INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE
    Publication number: 20140061928
    Abstract: An interconnection structure for being formed on bonding pads of a substrate in a semiconductor package is provided. The interconnection structure includes a nickel layer formed on each of the bonding pads, a metal layer formed on the nickel layer, and a solder material formed on the metal layer. The metal layer is made of one of gold, silver, lead and copper, and has a thickness in the range of 0.5 to 5 um. As such, when the solder material is reflowed to form solder bumps, no nickel-tin compound is formed between the solder bumps and the metal layer, thereby avoiding cracking or delamination of the solder bumps.
    Type: Application
    Filed: November 15, 2012
    Publication date: March 6, 2014
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chang-Fu Lin, Ho-Yi Tsai, Chin-Tsai Yao, Jui-Chung Ho, Ching-Hui Hung