Abstract: A liquid-cooling device for an electronic component includes a heat exchanger, a fin set, a plurality of heat pipes and a fan fastened to a front side of the fin set. The heat exchanger defines a sealed chamber and has two inclined faces facing opposite to each other on a top thereof, and has heat exchanging members in the sealed chamber. An outlet and an inlet are respectively formed on the two inclined faces and in fluidic communication with the sealed chamber. The fin set includes spaced fins laminated together. Each heat pipe includes a semicircular evaporating portion embedded in a bottom surface of the heat exchanger and a round condensing portion extending upwardly and received in the fin set. The fan is located above the heat exchanger and behind the inlet and outlet of the heat exchanger.

Abstract: A heat dissipation device for an electronic component includes a heat sink thermally contacting the electronic component and a label member fixed on the heat sink for providing information. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. Two engaging portions protrude from two spaced fins, towards each other. Two flanges angle outwardly from two opposite lateral sides of the label member and clasp the two engaging portions of the heat sink, respectively.

Abstract: A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base.

Abstract: A cooling fan for cooling a heat source includes a frame (10), a stator (20) mounted in the frame, a rotor (30) rotatably attached in the frame, a cover (40) fixed on the frame, and a pair of bearings (50, 60) received in the cover and the frame respectively. The rotor includes an impeller and a shaft (36) inserted through the impeller, wherein the shaft has an upper portion being received in one of the pair of bearings in the cover, and a lower portion being received in another one of the pair of bearing in the frame; thus, a vibration of the shaft can be prevented by supports of the pair of bearings, and the rotor is able to maintain a stable rotation, as the cooling fan is in a high speed operation.

Abstract: A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base.

Abstract: A radiator fan has a magnetic spindle rotatably positioned in a suspended situation between two magnetic guide seats, and a fan propeller fixedly mounted around one end portion of the magnetic spindle. When an alternating current runs in an inductor coil fixed in the radiator fan provided between the magnetic spindle and a magnet fixedly attached on the fan propeller, the fan propeller is driven by repulsion force of an alternating magnetic field produced by the inductor coil to run. Because the magnetic spindle is positioned in the suspended situation between the two guide seats, almost no frictional resistance exists between motional elements and static elements of the radiator fan, therefore the fan propeller runs free from noise in stable and reliable way, and the life span of the radiator fan is greatly increased.

Abstract: A CPU heat dissipating device includes a base made of heat conductive material, having a plurality of spaced fins defining air passages therebetween. A fan is disposed on the fins to induce force convection. An enlarged channel is formed between the fins to received therein an I-shaped spring plate having four co-planar limbs, each having an arm extending therefrom and substantially normal thereto with a catch formed on the free end of the arm to be received within a corresponding hole formed on a CPU casing. A circular bore is formed on the bottom of the channel and in communication therewith by means of a neck which supports the spring plate thereon. A circular rod is rotatably received within the bore, on which two radially-extending projections are provided.