Abstract: A semiconductor structure is provided. The semiconductor structure includes a first substrate, a second substrate opposite to the first substrate, a plurality of spacers disposed between the first substrate and the second substrate, and an adhesive material bonded with the first substrate and the second substrate within the two adjacent spacers. The invention also provides a method for fabricating the semiconductor structure.

Abstract: A camera module includes a lens module, an image sensor, at least one first spacer, and a bump element. The lens module includes a lens unit and a supporting unit connected to the lens unit. The image sensor is disposed corresponding in position to the lens unit for sensing light from the lens unit. The first spacer is disposed between the supporting unit of the lens module and the image sensor for separating the lens module and the image sensor. The bump element is disposed on the supporting unit. The bump element is located between the first spacer and the lens unit for preventing the first spacer from contacting the lens unit.

Abstract: A camera module includes a lens module, an image sensor, at least one first spacer, and a bump element. The lens module includes a lens unit and a supporting unit connected to the lens unit. The image sensor is disposed corresponding in position to the lens unit for sensing light from the lens unit. The first spacer is disposed between the supporting unit of the lens module and the image sensor for separating the lens module and the image sensor. The bump element is disposed on the supporting unit. The bump element is located between the first spacer and the lens unit for preventing the first spacer from contacting the lens unit.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a first substrate, a second substrate opposite to the first substrate, a plurality of spacers disposed between the first substrate and the second substrate, and an adhesive material bonded with the first substrate and the second substrate within the two adjacent spacers. The invention also provides a method for fabricating the semiconductor structure.

Abstract: A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.

Abstract: An LED lamp uses a plurality of LEDs as a light source. The LED lamp has a casing, a conduction layer, a PCB, a plurality of LED and a drive electronics. The conduction layer is placed in an inner of the casing. The conduction layer is metal, copper or aluminum, or nonmetal, silica gel or mica, for conducting the heat of the PCB caused by the current heating effects. The PCB placed on an upper surface of the conduction layer is for mounting the LED. Each LED is electrically connected to the PCB by way of shunt winding or in series for providing a light source. The drive electronics is electrically connected to the PCB for driving color rendering.

Abstract: An LED lamp is enabled to evenly emit lights, and is provided with a single set of indicators to provide different colors of light, and as least comprises a tubular case, a circuit board and at least an LED. The inner wall of the tubular case has a rough, light-homogenizing layer disposed thereon. The circuit board is provided together with a control unit on the bottom of the tubular case. The color mixing LED is provided on the circuit board.