Patents by Inventor Ching-Hung Lai

Ching-Hung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230267266
    Abstract: A method for forming a photomask includes following operations. A first photomask is received. The first photomask includes a first pattern and a first scattering bar. The first photomask is used to remove a first portion of a target layer to form a first opening and a second opening. The first opening corresponds to the first pattern, and the second opening corresponds to the first scattering bar. A second photomask is received. The second photomask includes a second pattern. The second photomask is used to remove a second portion of the target layer to form a third opening. The third opening corresponds to the second pattern. The second opening is widened to form the third opening using the second photomask.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 24, 2023
    Inventors: CHIN-MIN HUANG, CHING-HUNG LAI, JIA-GUEI JOU, YIN-CHUAN CHEN, CHI-MING TSAI
  • Patent number: 11669670
    Abstract: A method for forming a photomask is provided. The method includes: receiving an initial layout, the initial layout comprising a first pattern and a second pattern; decomposing the initial layout into a first layout including the first pattern and a second layout including the second pattern; inserting a third pattern into the first layout; overlapping the first layout including the first pattern and the third pattern to the second layout including the second pattern; increasing a width of the third pattern in the first layout overlapping the second pattern in the second layout to form a fourth pattern in the first layout; and outputting the first layout comprising the first pattern, the third pattern and the fourth pattern into a first photomask.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: June 6, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Min Huang, Ching-Hung Lai, Jia-Guei Jou, Yin-Chuan Chen, Chi-Ming Tsai
  • Patent number: 11262658
    Abstract: A photomask includes a transparent substrate and a shielding pattern disposed on the transparent substrate. The shielding pattern includes shielding island structures. The shielding island structures are separated from and spaced apart from one another by dividing lanes. The dividing lanes expose the underlying transparent substrate. The photomask is configured for a light of a wavelength, and the dividing lanes reduce or hinder a transmission of the light of the wavelength.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: March 1, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Yuan Chang, Chih-Chiang Tu, Ming-Ho Tsai, Ching-Hung Lai
  • Publication number: 20210333705
    Abstract: A photomask includes a transparent substrate and a shielding pattern disposed on the transparent substrate. The shielding pattern includes shielding island structures. The shielding island structures are separated from and spaced apart from one another by dividing lanes. The dividing lanes expose the underlying transparent substrate. The photomask is configured for a light of a wavelength, and the dividing lanes reduce or hinder a transmission of the light of the wavelength.
    Type: Application
    Filed: April 28, 2020
    Publication date: October 28, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Che-Yuan Chang, Chih-Chiang Tu, Ming-Ho Tsai, Ching-Hung Lai
  • Publication number: 20210089701
    Abstract: A method for forming a photomask is provided. The method includes: receiving an initial layout, the initial layout comprising a first pattern and a second pattern; decomposing the initial layout into a first layout including the first pattern and a second layout including the second pattern; inserting a third pattern into the first layout; overlapping the first layout including the first pattern and the third pattern to the second layout including the second pattern; increasing a width of the third pattern in the first layout overlapping the second pattern in the second layout to form a fourth pattern in the first layout; and outputting the first layout comprising the first pattern, the third pattern and the fourth pattern into a first photomask.
    Type: Application
    Filed: December 8, 2020
    Publication date: March 25, 2021
    Inventors: CHIN-MIN HUANG, CHING-HUNG LAI, JIA-GUEI JOU, YIN-CHUAN CHEN, CHI-MING TSAI
  • Patent number: 10867107
    Abstract: A method for forming a photomask is provided. The method includes: receiving an initial layout including a plurality of first patterns and a plurality of second patterns; decomposing the initial layout into a first layout including the plurality of first patterns and a second layout including the plurality of second patterns; inserting a plurality of third patterns into the first layout, wherein each of the plurality of third patterns is adjacent to at least one of the plurality of first patterns; comparing the first layout and the second layout; identifying a fourth pattern as an overlapping portion of the plurality of third patterns overlapping one of the plurality of second patterns; increasing a width of the fourth pattern; and outputting the first layout including the first patterns, the third patterns and the fourth patterns into a first photomask.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Min Huang, Ching-Hung Lai, Jia-Guei Jou, Yin-Chuan Chen, Chi-Ming Tsai
  • Publication number: 20200097631
    Abstract: A method for forming a photomask is provided. The method includes: receiving an initial layout including a plurality of first patterns and a plurality of second patterns; decomposing the initial layout into a first layout including the plurality of first patterns and a second layout including the plurality of second patterns; inserting a plurality of third patterns into the first layout, wherein each of the plurality of third patterns is adjacent to at least one of the plurality of first patterns; comparing the first layout and the second layout; identifying a fourth pattern as an overlapping portion of the plurality of third patterns overlapping one of the plurality of second patterns; increasing a width of the fourth pattern; and outputting the first layout including the first patterns, the third patterns and the fourth patterns into a first photomask.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: CHIN-MIN HUANG, CHING-HUNG LAI, JIA-GUEI JOU, YIN-CHUAN CHEN, CHI-MING TSAI
  • Patent number: 10274817
    Abstract: A mask includes a transparent substrate, a first pattern, a second pattern, and a sub-resolution auxiliary feature. The first pattern and the second pattern are over the transparent substrate. The first pattern has an area of 0.16 ?m2 to 60000 ?m2. The second pattern has an area of 0.16 ?m2 to 60000 ?m2. The sub-resolution auxiliary feature is over the transparent substrate and connects the first pattern and the second pattern.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Hung Lai, Chih-Chung Huang, Chih-Chiang Tu, Chung-Hung Lin, Chi-Ming Tsai, Ming-Ho Tsai
  • Publication number: 20180284595
    Abstract: A mask includes a transparent substrate, a first pattern, a second pattern, and a sub-resolution auxiliary feature. The first pattern and the second pattern are over the transparent substrate. The first pattern has an area of 0.16 ?m2 to 60000 ?m2. The second pattern has an area of 0.16 ?m2 to 60000 ?m2. The sub-resolution auxiliary feature is over the transparent substrate and connects the first pattern and the second pattern.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Hung Lai, Chih-Chung Huang, Chih-Chiang Tu, Chung-Hung Lin, Chi-Ming Tsai, Ming-Ho Tsai