Patents by Inventor Ching-Hung LI

Ching-Hung LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072082
    Abstract: A boron (B) layer may be formed as a passivation layer in a recess in which a vertical transfer gate is to be formed. The recess may then be filled with a gate electrode of the vertical transfer gate over the passivation layer (and/or one or more intervening layers) to form the vertical transfer gate. The passivation layer may be formed in the recess by epitaxial growth. The use of epitaxy to grow the passivation layer enables precise control over the profile, uniformity, and boron concentration in the passivation layer. Moreover, the use of epitaxy to grow the passivation layer may reduce the diffusion length of the passivation layer into the substrate of the pixel sensor, which provides increased area in the pixel sensor for the photodiode.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Yu-Hung CHENG, Tzu-Jui WANG, Ching I. LI
  • Patent number: 11916022
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yeong-Jyh Lin, Ching I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang, Ru-Liang Lee, Chung-Yi Yu
  • Patent number: 9048558
    Abstract: A receptacle connector includes a main body, an insulating base, a tenon member, a compressing spring, and a cap body. The main body includes a first concave area. The insulating base includes a second concave area. The first and the second concave area constitute a joint cavity and an opening. The tenon member erected on the bottom surface of the first concave area and is threaded through the compression spring. The cap body includes a sheath portion slidably threaded through the tenon member and a cover portion occupied a part of the opening. The sheath portion is connected to the compression spring and when the sheath portion of the cap body compresses the compression spring, the cover portion of the cap body is capable of moving from a closing position to an accessing position relative to the opening.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: June 2, 2015
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Fa-Chih Ke, Ching-Hung Li, Tzu-Ti Ko
  • Publication number: 20150140842
    Abstract: A receptacle connector includes a main body, an insulating base, a tenon member, a compressing spring, and a cap body. The main body includes a first concave area. The insulating base includes a second concave area. The first and the second concave area constitute a joint cavity and an opening. The tenon member erected on the bottom surface of the first concave area and is threaded through the compression spring. The cap body includes a sheath portion slidably threaded through the tenon member and a cover portion occupied a part of the opening. The sheath portion is connected to the compression spring and when the sheath portion of the cap body compresses the compression spring, the cover portion of the cap body is capable of moving from a closing position to an accessing position relative to the opening.
    Type: Application
    Filed: April 11, 2014
    Publication date: May 21, 2015
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Fa-Chih KE, Ching-Hung LI, Tzu-Ti KO