Patents by Inventor Ching-I Chou

Ching-I Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11020884
    Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 1, 2021
    Assignees: M-Victory Specific Material Co., Ltd., Wha Yueb Technology Co., Ltd.
    Inventors: Ching-I Chou, Yu-Chia Chen
  • Publication number: 20190358866
    Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Inventors: CHING-I CHOU, YU-CHIA CHEN
  • Publication number: 20180281244
    Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications in heat dissipation.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 4, 2018
    Inventors: CHING-I CHOU, YU-CHIA CHEN
  • Publication number: 20170292027
    Abstract: A manufacturing method for a thermal balancing conductive coating includes steps as: a) providing gluey liquid mixed by a first solution and a compound substance with a weight ratio ranging from 1:0.6 to 1:1.4; the compound substance is selected from a group consisting of fluorocarbon resin, fluororesin, acrylic acid resin, polyurethane, polyurea resin, unsaturated polyester, silicon resin, and mixtures thereof; b) providing a filler material mixed by a second solution and a filler substance with a weight ratio ranging from 1:0.1 to 1:0.6 and another weight ratio of the compound substance to the filler substance from 1:0.3 to 1:0.8; the filler substance includes a main ingredient selected from a group consisting of graphite, graphene platelets, graphene, graphite fiber, graphene fiber, BN, mica, and mixtures thereof; c)mixing the gluey liquid and the filler material to produce a thermal balancing conductive material, so as to form a thermal balancing conductive coating.
    Type: Application
    Filed: April 7, 2016
    Publication date: October 12, 2017
    Inventors: YU-CHIA CHEN, CHING-I CHOU
  • Publication number: 20170292025
    Abstract: A manufacturing method for a heat-dissipating coating includes steps as: a) providing a gluey liquid mixed by a first solution and a compound substance at a weight ratio of 1:0.6 to 1:1.4; the compound substance is selected from a group consisting of fluorocarbon resin, fluororesin, acrylic acid resin, polyurethane, polyurea resin, unsaturated polyester, epoxide, and mixtures thereof; b) providing a filler material mixed by a second solution and a filler substance at a weight ratio of 1:0.3 to 1:0.8 and another weight ratio of the compound substance to the filler substance being 1:0.1 to 1:0.6; the filler substance is selected from a group consisting of bamboo charcoal, carbon nanotube, graphite, graphene platelets, graphene, carbon spheres, carbon fibers, BN, AlN, mica, SiO2, TiO2, SiC, ZnO, GeO2, and mixtures thereof; c) mixing the gluey liquid and the filler material to produce a heat-dissipating material, so as to form a heat-dissipating coating.
    Type: Application
    Filed: April 7, 2016
    Publication date: October 12, 2017
    Inventors: YU-CHIA CHEN, CHING-I CHOU
  • Patent number: 8101670
    Abstract: The present invention discloses polymers prepared through the Diels-Alder reaction with benzoxazine groups in their main chains. Moreover, polymers with high molecular weight could be successfully prepared via this method. Furthermore, the mentioned polymers are able to undergo crosslinking reaction by heat treatment. Heat energy causes the ring-opening reaction of benzoxazine in polymer main chains to undergo crosslinking reaction, and cross-linked polymers are thereby formed with great flexibility and high crosslinking degree.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: January 24, 2012
    Assignee: Chung Yuan Christian University
    Inventors: Ying-Ling Liu, Ching-I Chou
  • Publication number: 20100216900
    Abstract: The present invention discloses polymers prepared through the Diels-Alder reaction with benzoxazine groups in their main chains. Moreover, polymers with high molecular weight could be successfully prepared via this method. Furthermore, the mentioned polymers are able to undergo crosslinking reaction by heat treatment. Heat energy causes the ring-opening reaction of benzoxazine in polymer main chains to undergo crosslinking reaction, and cross-linked polymers are thereby formed with great flexibility and high crosslinking degree.
    Type: Application
    Filed: April 21, 2009
    Publication date: August 26, 2010
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Ying-Ling Liu, Ching-I Chou