Patents by Inventor Ching-Jen Chen

Ching-Jen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260122764
    Abstract: A computing device includes a printed circuit board (PCB) having a ground plane and a power plane. The ground plane has a length L1 that extends between a first ground edge and a second ground edge. The power plane has a length L2 that extends between a first power edge and a second power edge. The ground plane is parallel to and separated from the power plane by a distance H. The computing device further includes a heat sink integrated with the PCB. The heat sink is parallel to and coupled to the power plane. The heat sink has a length L3 that extends between a first sink edge and a second sink edge. The length L3 of the heat sink is greater than at least one of the length L1 of the ground plane or the length L2 of the power plane.
    Type: Application
    Filed: October 30, 2024
    Publication date: April 30, 2026
    Inventor: Ching-Jen CHEN
  • Publication number: 20260107408
    Abstract: A server system includes a server chassis with heat-generating electronic components. A cooling system is mounted on the server chassis and provides cooling air to the heat-generating electronic components. A ventilation channel is disposed on the server chassis between the cooling system and the heat-generating electronic components. The ventilation channel includes a cooling path along which the cooling air flows. The cooling path is formed at least in part between two sidewalls and a cover plate. The ventilation channel further includes a wire path configured to receive a wire. The wire path is formed in part as a slotted region that is recessed within the cover plate.
    Type: Application
    Filed: October 10, 2024
    Publication date: April 16, 2026
    Inventor: Ching-Jen CHEN
  • Publication number: 20250338464
    Abstract: A fabric-over-foam (FOF) gasket assembly includes a foam core having a shaped suited for sealing a gap in a structure of the computing device. The foam core has a base surface and a sealing surface. The FOF gasket assembly further includes an electrically conductive fabric wrapped around the foam core, and a conductive adhesive attached to the base surface. The conductive adhesive includes a release coat layer for attaching the conductive adhesive to the base surface of the foam core, a carrier layer attached to the release coat layer, and a release paper layer removably attached to the carrier layer. The carrier layer includes a polyethylene terephthalate (PET) layer forming a structural base of the threads, an inner layer of a copper material, and an outer layer of a nickel material.
    Type: Application
    Filed: July 26, 2024
    Publication date: October 30, 2025
    Inventor: Ching-Jen CHEN
  • Patent number: 12426221
    Abstract: An EMI gasket assembly is disclosed that blocks gaps between a device card and a slot in a chassis that allows insertion of the device card. The EMI gasket assembly is attachable to a front plate of the device card such as an OCP 3.0 Specification compliant device card. The EMI gasket assembly includes a fabric-over-foam gasket extending the width of the front plate. The EMI gasket assembly includes a plurality of finger gaskets attachable to the front plate. The finger gaskets are positioned to hold the fabric-over-foam gasket on the front plate.
    Type: Grant
    Filed: March 4, 2024
    Date of Patent: September 23, 2025
    Assignee: QUANTA COMPUTER INC.
    Inventor: Ching-Jen Chen
  • Publication number: 20250280521
    Abstract: An EMI gasket assembly is disclosed that blocks gaps between a device card and a slot in a chassis that allows insertion of the device card. The EMI gasket assembly is attachable to a front plate of the device card such as an OCP 3.0 Specification compliant device card. The EMI gasket assembly includes a fabric-over-foam gasket extending the width of the front plate. The EMI gasket assembly includes a plurality of finger gaskets attachable to the front plate. The finger gaskets are positioned to hold the fabric-over-foam gasket on the front plate.
    Type: Application
    Filed: March 4, 2024
    Publication date: September 4, 2025
    Inventor: Ching-Jen CHEN
  • Patent number: 12324137
    Abstract: A computing device for inhibiting electrostatic discharge (ESD) in a computing system, the computing device including a mainboard with computing circuitry for the computing system, a tray in which the mainboard is affixed, and a composite liner for absorbing high-frequency energy and electromagnetic interference from the ESD. The composite liner includes a high-frequency energy absorption layer and an insulation layer coupled to a first surface of the high-frequency energy absorption layer. The high-frequency energy absorption layer includes a high-frequency energy absorption material, and the insulation layer includes an electrical-insulating material. A circuit board enclosure includes the composite liner and a panel with the composite liner at least partially lining an internal receiving surface of the panel. A circuit board is positioned inside the circuit board enclosure with the composite liner interposed between the circuit board and the panel to protect the electronic component from ESD.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: June 3, 2025
    Assignee: QUANTA COMPUTER INC.
    Inventor: Ching-Jen Chen
  • Publication number: 20240381599
    Abstract: A computing device for inhibiting electrostatic discharge (ESD) in a computing system, the computing device including a mainboard with computing circuitry for the computing system, a tray in which the mainboard is affixed, and a composite liner for absorbing high-frequency energy and electromagnetic interference from the ESD. The composite liner includes a high-frequency energy absorption layer and an insulation layer coupled to a first surface of the high-frequency energy absorption layer. The high-frequency energy absorption layer includes a high-frequency energy absorption material, and the insulation layer includes an electrical-insulating material. A circuit board enclosure includes the composite liner and a panel with the composite liner at least partially lining an internal receiving surface of the panel. A circuit board is positioned inside the circuit board enclosure with the composite liner interposed between the circuit board and the panel to protect the electronic component from ESD.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 14, 2024
    Inventor: Ching-Jen CHEN
  • Patent number: 11147196
    Abstract: An air duct formed from an electromagnetic wave absorber in the form of a sheet is disclosed. The sheet can be bent into a duct or scored, and folded at the score lines to bring the ends of the sheet into proximity. The ends can then be joined by adhesive, welding, or mechanical fasters. The air ducts disclosed herein provide dual functions of providing ventilation for electronic components in an electronic module, while at the same time, reducing electromagnetic interference (EMI). One or more air ducts, of the same or different dimensions, shapes, volumes can be combined with electronic modules, such as a server, to provide both ventilation and EMI suppression to various components within the electronic module.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: October 12, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Ching-Jen Chen, Cheng-Hsien Lee
  • Publication number: 20210315136
    Abstract: An air duct formed from an electromagnetic wave absorber in the form of a sheet is disclosed. The sheet can be bent into a duct or scored, and folded at the score lines to bring the ends of the sheet into proximity. The ends can then be joined by adhesive, welding, or mechanical fasters. The air ducts disclosed herein provide dual functions of providing ventilation for electronic components in an electronic module, while at the same time, reducing electromagnetic interference (EMI). One or more air ducts, of the same or different dimensions, shapes, volumes can be combined with electronic modules, such as a server, to provide both ventilation and EMI suppression to various components within the electronic module.
    Type: Application
    Filed: April 3, 2020
    Publication date: October 7, 2021
    Inventors: Ching-Jen CHEN, Cheng-Hsien LEE
  • Patent number: 7842281
    Abstract: Magnetic nanoparticle compositions are provided which provide an inherent temperature regulator for use in magnetic heating, particularly for use in magnetic hyperthermia medical treatments. The composition includes magnetic nanoparticles having a Curie temperature of between 40 and 46° C., preferably about 42° C., and may further include a polymeric material and optionally a drug or radiosensitizing agent. Methods of hyperthermia treatment of a patient in need thereof are provided which include the steps of administering to the patient a composition comprising magnetic nanoparticles having a Curie temperature of between 40 and 46° C.; and exposing the magnetic nanoparticles in the patient to an alternating magnetic field effective to generate hysteresis heat in the nanoparticles.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: November 30, 2010
    Assignee: The Florida State University Research Foundation
    Inventors: Yousef Haik, Ching-Jen Chen
  • Patent number: 7803262
    Abstract: Methods are provided for aligning carbon nanotubes and for making a composite material comprising aligned carbon nanotubes. The method for aligning carbon nanotubes comprises adsorbing magnetic nanoparticles to carbon nanotubes dispersed in a fluid medium to form a magnetic particle-carbon nanotube composite in the fluid medium; and exposing the composite to a magnetic field effective to align the nanotubes in the fluid medium. The method for making a composite material comprising aligned carbon nanotubes comprises (1) adsorbing magnetic nanoparticles to carbon nanotubes to form a magnetic particle-carbon nanotube composite; (2) dispersing the magnetic particle-carbon nanotube composite in a fluid matrix material to form a mixture; (3) exposing the mixture to a magnetic field effective to align the nanotubes in the mixture; and (4) solidifying the fluid matrix material to form a nanotube/matrix material composite comprising the aligned nanotubes which remain aligned in the absence of said magnetic field.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: September 28, 2010
    Assignee: Florida State University Research Foundation
    Inventors: Yousef Haik, Jhunu Chatterjee, Ching-Jen Chen
  • Publication number: 20100099941
    Abstract: Magnetic nanoparticle compositions are provided which provide an inherent temperature regulator for use in magnetic heating, particularly for use in magnetic hyperthermia medical treatments. The composition includes magnetic nanoparticles having a Curie temperature of between 40 and 46° C., preferably about 42° C., and may further include a polymeric material and optionally a drug or radiosensitizing agent. Methods of hyperthermia treatment of a patient in need thereof are provided which include administering to the patient a composition comprising magnetic nanoparticles having a Curie temperature of between 40 and 46° C.; and exposing the magnetic nanoparticles in the patient to an alternating magnetic field effective to generate hysteresis heat in the nanoparticles.
    Type: Application
    Filed: December 23, 2009
    Publication date: April 22, 2010
    Applicant: FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION
    Inventors: Yousef Haik, Ching-Jen Chen
  • Publication number: 20090301272
    Abstract: A cable pliers structure includes a left plier body and a right plier body pivotally connected to each other. The right plier body has an adjusting region. The left plier body is connected with a drive seat movably disposed on one side of the adjusting region. A pressing block is disposed at the top of the drive seat. A clamping component is disposed in the adjusting region and has a clamp base that is movable relative to the pressing block. When the relative distance between the clamp base and the pressing block is changed, that is, the clamp base moves away from or approaches the pressing block, the distance is equivalent to the specification and dimension of a cable connector to be used. Therefore, the cable pliers structure is suitable for cable connectors of various specifications and dimensions through adjusting the distance, without replacing the pressing block.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 10, 2009
    Applicant: LI-YAO INDUSTRIAL CO., LTD.
    Inventor: Ching-Jen CHEN
  • Patent number: 7308815
    Abstract: A terminal crimping pliers is provided, which is designed with a simple structure, and is used to improve the disadvantages of the conventional terminal crimping pliers, such as being difficult to be grasped and difficult for forces applied thereon. The terminal crimping pliers can be extended with a small angle, through a vertical stopping slot combined with two stopping slots with oblique angles, and the terminal crimping pliers can be held closed with a small force.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: December 18, 2007
    Assignee: Pin-Ruei Industrial Co., Ltd.
    Inventor: Ching-Jen Chen
  • Publication number: 20070169531
    Abstract: A terminal crimping pliers is provided, which is designed with a simple structure, and is used to improve the disadvantages of the conventional terminal crimping pliers, such as being difficult to be grasped and difficult for forces applied thereon. The terminal crimping pliers can be extended with a small angle, through a vertical stopping slot combined with two stopping slots with oblique angles, and the terminal crimping pliers can be held closed with a small force.
    Type: Application
    Filed: January 20, 2006
    Publication date: July 26, 2007
    Inventor: Ching-Jen Chen
  • Patent number: 7081489
    Abstract: Polymeric nanoencapsulation methods, which combine sonication and nonsolvent temperature induced crystallization, are provided. The steps include (a) providing active agent nanoparticles having an average diameter between about 5 and about 100 nm; (b) treating said active agent nanoparticles (e.g.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: July 25, 2006
    Assignee: Florida State University Research Foundation
    Inventors: Ching-Jen Chen, Yousef Haik, Jhunu Chatterjee
  • Patent number: 6989196
    Abstract: Microencapsulation methods and products are provided. The method includes forming, at a first temperature, a emulsion which comprises aqueous microdroplets, including the agent (e.g., a magnetic material or drug) and a cross-linkable matrix material (e.g., a protein such as albumin), dispersed in a hydrophobic continuous phase comprising an oil and an oil-soluble surfactant, the first temperature being below the temperature effective to initiate cross-linking of the matrix material, and then heating the emulsion to a temperature and for a time effective to cause the matrix material to self-crosslink, to form microparticles comprising the agent encapsulated by the crosslinked matrix material.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: January 24, 2006
    Assignee: Florida State University Research Foundation
    Inventors: Jhunu Chatterjee, Yousef Haik, Ching-Jen Chen
  • Publication number: 20050249817
    Abstract: Magnetic nanoparticle compositions are provided which provide an inherent temperature regulator for use in magnetic heating, particularly for use in magnetic hyperthermia medical treatments. The composition includes magnetic nanoparticles having a Curie temperature of between 40 and 46° C., preferably about 42° C., and may further include a polymeric material and optionally a drug or radiosensitizing agent. Methods of hyperthermia treatment of a patient in need thereof are provided which include the steps of administering to the patient a composition comprising magnetic nanoparticles having a Curie temperature of between 40 and 46° C.; and exposing the magnetic nanoparticles in the patient to an alternating magnetic field effective to generate hysteresis heat in the nanoparticles.
    Type: Application
    Filed: May 10, 2005
    Publication date: November 10, 2005
    Inventors: Yousef Haik, Ching-Jen Chen
  • Publication number: 20050239948
    Abstract: Methods are provided for aligning carbon nanotubes and for making a composite material comprising aligned carbon nanotubes. The method for aligning carbon nanotubes comprises adsorbing magnetic nanoparticles to carbon nanotubes dispersed in a fluid medium to form a magnetic particle-carbon nanotube composite in the fluid medium; and exposing the composite to a magnetic field effective to align the nanotubes in the fluid medium. The method for making a composite material comprising aligned carbon nanotubes comprises (1) adsorbing magnetic nanoparticles to carbon nanotubes to form a magnetic particle-carbon nanotube composite; (2) dispersing the magnetic particle-carbon nanotube composite in a fluid matrix material to form a mixture; (3) exposing the mixture to a magnetic field effective to align the nanotubes in the mixture; and (4) solidifying the fluid matrix material to form a nanotube/matrix material composite comprising the aligned nanotubes which remain aligned in the absence of said magnetic field.
    Type: Application
    Filed: April 23, 2004
    Publication date: October 27, 2005
    Inventors: Yousef Haik, Jhunu Chatterjee, Ching-Jen Chen
  • Patent number: D506660
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: June 28, 2005
    Assignee: Li-Yao Industrial Co., Ltd.
    Inventor: Ching-Jen Chen