Patents by Inventor Ching-Jen Wang
Ching-Jen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11969236Abstract: A wearable device for measuring blood pressure comprises a housing with through-holes formed thereon, a processing unit disposed in the housing, a display connected to the processing unit, a plurality of sensors connected to the processing unit, the sensors being configured to transmit at least one physiological signal to the processing unit via the through-holes, and a time delay structure connected between one of the through-holes and one of the sensors and configured to lengthen a path distance between the skin surface and the sensor, wherein the processing unit is configured to determine a systolic arterial pressure and a diastolic arterial pressure by the at least one physiological signal and a Moens-Korteweg (MK) function, and to control the display to display the systolic arterial pressure and the diastolic arterial pressure to be read by the user.Type: GrantFiled: May 24, 2019Date of Patent: April 30, 2024Assignee: Accurate Meditech IncInventors: Kuan Jen Wang, Cheng Yan Guo, Ching-Hung Huang
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Publication number: 20240096818Abstract: Devices and method for forming a shielding assembly including a first chip package structure sensitive to magnetic interference (MI), a second chip package structure sensitive to electromagnetic interference (EMI), and a shield surrounding sidewalls and top surfaces of the first chip package structure and the second chip package structure, in which the shield is a magnetic shielding material. In some embodiments, the shield may include silicon steel, in some embodiments, the shield may include Mu-metal. The silicon-steel-based or Mu-metal-based shield may provide both EMI and MI protection to multiple chip package structures with various susceptibilities to EMI and MI.Type: ApplicationFiled: April 20, 2023Publication date: March 21, 2024Inventors: Harry-Hak-Lay Chuang, Yuan-Jen Lee, Kuo-An Liu, Ching-Huang Wang, C.T. Kuo, Tien-Wei Chiang
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20240087861Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Tsung-Jen YANG, Yi-Zhen CHEN, Chih-Pin WANG, Chao-Li SHIH, Ching-Hou SU, Cheng-Yi HUANG
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Patent number: 11304347Abstract: An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.Type: GrantFiled: March 9, 2021Date of Patent: April 12, 2022Assignee: PEGATRON CORPORATIONInventors: Yu-Ti Kuo, Chien-Yi Lee, Ching-Jen Wang
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Publication number: 20210368660Abstract: An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.Type: ApplicationFiled: March 9, 2021Publication date: November 25, 2021Applicant: PEGATRON CORPORATIONInventors: Yu-Ti Kuo, Chien-Yi Lee, Ching-Jen Wang
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Patent number: 11050868Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.Type: GrantFiled: June 24, 2019Date of Patent: June 29, 2021Assignee: Pegatron CorporationInventors: Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Hsiao-Wen Lee, Ching-Jen Wang
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Patent number: 10530080Abstract: An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.Type: GrantFiled: July 12, 2018Date of Patent: January 7, 2020Assignee: PEGATRON CORPORATIONInventors: Yu-Ti Kuo, Yen-Hsing Chu, Chien-Yi Lee, Ching-Jen Wang
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Publication number: 20190312963Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.Type: ApplicationFiled: June 24, 2019Publication date: October 10, 2019Inventors: Yu-Ti KUO, Wen-Hsieh HSIEH, Chao-Tang CHIU, Chien-Yi LEE, Hsiao-Wen LEE, Ching-Jen WANG
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Patent number: 10397385Abstract: An internet phone system includes an internet phone main body, at least one expansion device and at least one multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card.Type: GrantFiled: September 14, 2016Date of Patent: August 27, 2019Assignee: PEGATRON CORPORATIONInventors: Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Hsiao-Wen Lee, Ching-Jen Wang
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Publication number: 20190067852Abstract: An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.Type: ApplicationFiled: July 12, 2018Publication date: February 28, 2019Applicant: PEGATRON CORPORATIONInventors: Yu-Ti Kuo, Yen-Hsing Chu, Chien-Yi Lee, Ching-Jen Wang
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Publication number: 20170180525Abstract: An internet phone system includes an internet phone main body, at least one expansion device and at least one multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card.Type: ApplicationFiled: September 14, 2016Publication date: June 22, 2017Inventors: Yu-Ti KUO, Wen-Hsieh HSIEH, Chao-Tang CHIU, Chien-Yi LEE, Hsiao-Wen LEE, Ching-Jen WANG
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Patent number: 8760885Abstract: An electronic device including a conductive element, a conductive layer, and a case is provided. The case has a surface, a first supporting member, and a second supporting member. The first supporting member and the second supporting member are disposed on the surface, and the first supporting member has a suspending arm. The case, the first supporting member and the second supporting member are integrally formed, and the conductive layer exists on the surface of the case, the first supporting member, and the second supporting member. The conductive element presses the first suspending arm to contact the second supporting member, such that a ground circuit is formed with the conductive element, the first suspending arm, the second supporting member, and the surface.Type: GrantFiled: January 12, 2012Date of Patent: June 24, 2014Assignee: Pegatron CorporationInventors: Chien-Yi Lee, Ching-Jen Wang, Yu-Ti Kuo, Chun-Liang Chen
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Patent number: 8553387Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.Type: GrantFiled: March 7, 2011Date of Patent: October 8, 2013Assignee: PegatronInventors: Ching-Jen Wang, Fang-Teng Chung, Wen-Hsieh Hsieh
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Publication number: 20120182704Abstract: An electronic device including a conductive element, a conductive layer, and a case is provided. The case has a surface, a first supporting member, and a second supporting member. The first supporting member and the second supporting member are disposed on the surface, and the first supporting member has a suspending arm. The case, the first supporting member and the second supporting member are integrally formed, and the conductive layer exists on the surface of the case, the first supporting member, and the second supporting member. The conductive element presses the first suspending arm to contact the second supporting member, such that a ground circuit is formed with the conductive element, the first suspending arm, the second supporting member, and the surface.Type: ApplicationFiled: January 12, 2012Publication date: July 19, 2012Applicant: PEGATRON CORPORATIONInventors: Chien-Yi Lee, Ching-Jen Wang, Yu-Ti Kuo, Chun-Liang Chen
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Publication number: 20110317378Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.Type: ApplicationFiled: March 7, 2011Publication date: December 29, 2011Inventors: Ching-Jen Wang, Fang-Teng Chung, Wen-Hsieh Hsieh
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Patent number: 8023278Abstract: A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.Type: GrantFiled: May 14, 2008Date of Patent: September 20, 2011Assignee: Asustek Computer Inc.Inventor: Ching-Jen Wang
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Patent number: 7953134Abstract: A semiconductor light-emitting device includes a substrate, a first cladding layer over the substrate, an active region on the first cladding layer, and a second cladding layer on the active region, wherein the active region includes a first type barrier layer that is doped and a second type barrier layer that is undoped, the first type barrier layer being closer to the first cladding layer than the second type barrier layer.Type: GrantFiled: December 31, 2008Date of Patent: May 31, 2011Assignee: Epistar CorporationInventors: Ming-Ta Chin, Kuo-Feng Huang, Ping-Fei Shen, Ching-Jen Wang, Shih-Pang Chang
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Publication number: 20100166033Abstract: A semiconductor light-emitting device includes a substrate, a first cladding layer over the substrate, an active region on the first cladding layer, and a second cladding layer on the active region, wherein the active region includes a first type barrier layer that is doped and a second type barrier layer that is undoped, the first type barrier layer being closer to the first cladding layer than the second type barrier layer.Type: ApplicationFiled: December 31, 2008Publication date: July 1, 2010Inventors: Ming-Ta CHIN, Kuo-Feng HUANG, Ping-Fei SHEN, Ching-Jen WANG, Shih-Pang CHANG
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Patent number: 7699648Abstract: This invention discloses a stackable connector assembly, which includes a first connector, a second connector, a shielding member, a contact member, and a ground member. The second connector is placed above the first connector. The shielding member is covered on the first connector. The contact member is used for connecting the shielding member and the ground member. This structure can reduce the electromagnetic radiation from the first connector.Type: GrantFiled: January 16, 2009Date of Patent: April 20, 2010Assignee: ASUSTeK Computer Inc.Inventors: Ching-Jen Wang, Chu-Chieh Pan, Chih-hao Kuo