Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.

Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.

Abstract: A method for laser carving of paint on an outer surface of a vehicle wheel includes a step of priming: priming an outer surface of the wheel to form a painted surface; a step of laser carving: carving the primer from a selected area of the wheel by laser to remove the painted surface from the selected area, the selected area having an exposed area with metallic luster, and a step of fine-polish: polishing the outer surface of the wheel to form a fine-polished area at the exposed area. The painted surface on the wheel can be quickly removed to disclose a selected area with metallic luster, while the wheel is prevented from corrosion so as to reduce manufacturing cost and increase precision.

Abstract: A method for laser carving of paint on an outer surface of a vehicle wheel includes a step of priming: priming an outer surface of the wheel to form a painted surface; a step of laser carving: carving the primer from a selected area of the wheel by laser to remove the painted surface from the selected area, the selected area having an exposed area with metallic luster, and a step of fine-polish: polishing the outer surface of the wheel to form a fine-polished area at the exposed area. The painted surface on the wheel can be quickly removed to disclose a selected area with metallic luster, while the wheel is prevented from corrosion so as to reduce manufacturing cost and increase precision.