Abstract: A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.

Abstract: A semiconductor structure and a method of forming the same are disclosed. A method of forming a semiconductor structure includes the following operations. An insulating layer is formed over a substrate. A metal feature is formed in the insulating layer. An argon-containing plasma treatment is performed to the insulating layer and the metal feature.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. An alignment process is performed on a first semiconductor workpiece and a second semiconductor workpiece by virtue of a plurality of workpiece pins. The first semiconductor workpiece is bonded to the second semiconductor workpiece. A shift value is determined between the first and second semiconductor workpieces by virtue of a first plurality of alignment marks on the first semiconductor workpiece and a second plurality of alignment marks on the second semiconductor workpiece. A layer of an integrated circuit (IC) structure is formed over the second semiconductor workpiece based at least in part on the shift value.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a semiconductor substrate having sidewalls that form one or more trenches. The one or more trenches are disposed along opposing sides of a photodiode and vertically extend from an upper surface of the semiconductor substrate to within the semiconductor substrate. A doped region is arranged along the upper surface of the semiconductor substrate and along opposing sides of the photodiode. A first dielectric lines the sidewalls of the semiconductor substrate and the upper surface of the semiconductor substrate. A second dielectric lines sidewalls and an upper surface of the first dielectric. The doped region has a width laterally between a side of the photodiode and a side of the first dielectric. The width of the doped region varies at different heights along the side of the photodiode.

Abstract: A paper pickup mechanism includes a mechanical frame, a pickup roller module, a feeding roller module, a driving device, a separation roller module and an energy storage element. The mechanical frame has a platform. The pickup roller module is pivoted to and connected to the mechanical frame. The feeding roller module is pivoted to and connected to the mechanical frame. The driving device is mounted to the mechanical frame. The separation roller module is pivoted to and connected to the mechanical frame. The energy storage element is mounted between the mechanical frame and the separation roller module. When the separation roller module rotates together with the feeding roller module in a forward direction, the energy storage element accumulates energies. When more than one piece of paper is fed into the paper pickup mechanism, the energy storage element releases the energies.

Abstract: A paper pickup mechanism includes a mechanical frame, a pickup roller module, a feeding roller module, a driving device, a separation roller module and an energy storage element. The mechanical frame has a platform. The pickup roller module is pivoted to and connected to the mechanical frame. The feeding roller module is pivoted to and connected to the mechanical frame. The driving device is mounted to the mechanical frame. The separation roller module is pivoted to and connected to the mechanical frame. The energy storage element is mounted between the mechanical frame and the separation roller module. When the separation roller module rotates together with the feeding roller module in a forward direction, the energy storage element accumulates energies. When more than one piece of paper is fed into the paper pickup mechanism, the energy storage element releases the energies.

Abstract: A rotary paddle level switch has a housing, a driving unit, two switches, a resilient member, a clutch, a transmission shaft, and a propeller. A resilient clip of the clutch holds a non-circular actuation section of the transmission shaft. When the driving unit drives the clutch to rotate, the transmission shaft and the propeller are driven by the clutch. When the propeller is rapidly rotated by suddenly exerting an excessively large external force thereon, as the resilient clip holds the transmission shaft by elastic force, the fast rotating transmission shaft removes itself from the holding of the resilient clip and is rotated without driving the resilient clip to rotate, thereby avoiding the transmission of the external force and damage to the driving unit. As the clutch just needs a clutch stand and a resilient clip to achieve the foregoing function, the level switch is structurally simple and relatively inexpensive.

Abstract: A rotary paddle level switch has a housing, a driving unit, two switches, a resilient member, a clutch, a transmission shaft, and a propeller. A resilient clip of the clutch holds a non-circular actuation section of the transmission shaft. When the driving unit drives the clutch to rotate, the transmission shaft and the propeller are driven by the clutch. When the propeller is rapidly rotated by suddenly exerting an excessively large external force thereon, as the resilient clip holds the transmission shaft by elastic force, the fast rotating transmission shaft removes itself from the holding of the resilient clip and is rotated without driving the resilient clip to rotate, thereby avoiding the transmission of the external force and damage to the driving unit. As the clutch just needs a clutch stand and a resilient clip to achieve the foregoing function, the level switch is structurally simple and relatively inexpensive.

Abstract: A sensing device can detect material depth, liquid-level, and temperature. The sensing device has a probe, a control module, a volume sensing module, a thermal sensing module, an output module, and a power module. The probe has two material electrodes connected to the volume sensing module and a thermal electrode connected to the thermal sensing module. A rated voltage is applied at the material electrodes based on radio frequency admittance. A current deviation of the material electrodes is obtained by the volume sensing module, and calculated via the control module by material characteristics to obtain a correct storage amount of material. A temperature at each material depth is correctly detected by the thermal electrode. Steel cable is used as the material of the material electrodes of the probe to detect material depth or liquid level with high impact resistant ability.

Abstract: A sensing device can detect material depth, liquid-level, and temperature. The sensing device has a probe, a control module, a volume sensing module, a thermal sensing module, an output module, and a power module. The probe has two material electrodes connected to the volume sensing module and a thermal electrode connected to the thermal sensing module. A rated voltage is applied at the material electrodes based on radio frequency admittance. A current deviation of the material electrodes is obtained by the volume sensing module, and calculated via the control module by material characteristics to obtain a correct storage amount of material. A temperature at each material depth is correctly detected by the thermal electrode. Steel cable is used as the material of the material electrodes of the probe to detect material depth or liquid level with high impact resistant ability.

Abstract: A honeycomb heat dissipating apparatus made of a composite metal material includes honeycomb cells that are integrally formed by vacuum die casting, and continuous convex and concave distal surfaces disposed around the periphery of the heat dissipating apparatus, and an adjacent surface of each cell is a thin surface, and the heat dissipating apparatus can be in a standalone mode, or combined with other heat dissipating apparatuses. One or more honeycomb heat dissipating apparatuses can be installed on a circuit board or an electronic component of a lamp or an electric appliance, such that the heat dissipating apparatus can dissipate heat quickly by the honeycomb cells without occupying much space. The invention can increase the heat dissipating area for a faster heat dissipating effect and change the stylish appearance to achieve the aesthetic effect.