Patents by Inventor Ching-Jui CHUANG

Ching-Jui CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240048111
    Abstract: A manufacturing method of a piezoelectric vibration element includes at least the following steps. Quartz wafer is provided. A first metal material layer and a second metal material layer are fully formed on a first surface and a second surface of the quartz wafer, respectively. A first photoresist material layer and a second photoresist material layer are fully formed on the first metal material layer and the second metal material layer, respectively. Only the first photoresist material layer is performed to an exposure and development process to form a first patterned photoresist layer. A portion of the first metal material layer is removed by the first patterned photoresist layer to form a metal pattern. The first patterned photoresist layer and the second photoresist material layer are removed.
    Type: Application
    Filed: September 8, 2022
    Publication date: February 8, 2024
    Applicant: TXC Corporation
    Inventors: Po-Sheng Huang, Chieh-Jen Cho, Shih-Feng Hsueh, Ching-Jui Chuang, Tzu-Fan Chen, Chiu-Hua Chen
  • Patent number: 9230927
    Abstract: A method of fabricating a wafer-level chip package is provided. First, a wafer with two adjacent chips is provided, the wafer having an upper surface and a lower surface, and one side of each chip includes a conducting pad on the lower surface. A recess and an isolation layer extend from the upper surface to the lower surface, which the recess exposes the conducting pad. A part of the isolation layer is disposed in the recess with an opening to expose the conducting pad. A conductive layer is formed on the isolation layer and the conductive pad, and a photo-resist layer is spray coated on the conductive layer. The photo-resist layer is exposed and developed to expose the conductive layer, and the conductive layer is etched to form a redistribution layer. After stripping the photo-resist layer, a solder layer is formed on the isolation layer and the redistribution layer.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: January 5, 2016
    Assignee: XINTEC INC.
    Inventors: Chuan-Jin Shiu, Tsang-Yu Liu, Chih-Wei Ho, Shih-Hsing Chan, Ching-Jui Chuang
  • Publication number: 20150099357
    Abstract: A method of fabricating a wafer-level chip package is provided. First, a wafer with two adjacent chips is provided, the wafer having an upper surface and a lower surface, and one side of each chip includes a conducting pad on the lower surface. A recess and an isolation layer extend from the upper surface to the lower surface, which the recess exposes the conducting pad. A part of the isolation layer is disposed in the recess with an opening to expose the conducting pad. A conductive layer is formed on the isolation layer and the conductive pad, and a photo-resist layer is spray coated on the conductive layer. The photo-resist layer is exposed and developed to expose the conductive layer, and the conductive layer is etched to form a redistribution layer. After stripping the photo-resist layer, a solder layer is formed on the isolation layer and the redistribution layer.
    Type: Application
    Filed: October 7, 2014
    Publication date: April 9, 2015
    Inventors: Chuan-Jin SHIU, Tsang-Yu LIU, Chih-Wei HO, Shih-Hsing CHAN, Ching-Jui CHUANG
  • Patent number: D865239
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: October 29, 2019
    Assignee: CUB ELECPARTS INC.
    Inventors: San-Chuan Yu, Ching-Jui Chuang, Yi-Hui Hsu, Cheng-Hsin Li, Wei-Chang Liang, Chi-Ling Chang, Ya-Ling Chi
  • Patent number: D865273
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: October 29, 2019
    Assignee: CUB ELECPARTS INC.
    Inventors: San-Chuan Yu, Ching-Jui Chuang, Yi-Hui Hsu, Cheng-Hsin Li, Wei-Chang Liang, Chi-Ling Chang, Ya-Ling Chi
  • Patent number: D865274
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: October 29, 2019
    Assignee: CUB ELECPARTS INC.
    Inventors: San-Chuan Yu, Ching-Jui Chuang, Yi-Hui Hsu, Cheng-Hsin Li, Wei-Chang Liang, Chi-Ling Chang, Ya-Ling Chi