Abstract: A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.

Abstract: A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.

Abstract: A semiconductor package device testing apparatus includes a conductive component, a first main body, a second main body, a pressing member, and a heating component. The conductive component has a plurality of conductive portions electrically connect with the pins of the semiconductor package device and disposed at one side of the first main body. The second main body is disposed at the other side of the first main body. In addition, the first main body has a first opening to define a space for receiving the semiconductor package device. The semiconductor package device is disposed within the first opening by the pressing member. The pressing member connects to the second main body through a second opening of the second main body. The heating component mounts on the first main body to heat the semiconductor package device.

Abstract: An alignment apparatus for an integrated circuit (IC) test handler is disclosed. The alignment apparatus of the present invention installs a plurality of first guide pins and a plurality of second guide pins on a load board stiffener, and the first and second guide pins penetrate a load board and a surface mount matrix (SMM) frame member used for fastening a SMM sequentially from the backsides of load board and SMM frame member. When an IC device packaged by the ball grid array (BGA) method is in an electrical test, the present invention can shorten the working distance of a test arm of the IC test handler for enhancing the stability of testing process, thereby promoting the testing yield. Furthermore, with a shorter working distance, the output force from the test arm is smaller, so that the force acted on solder balls located at the bottom of the BGA device is smaller, thereby prolonging the service life of SMM contacting the solder balls.

Abstract: A testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

Abstract: The present invention relates to a testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

Abstract: An apparatus for preventing electrostatic destruction of integrated circuits coats an electrostatic agent on surfaces of the integrated circuits to avoid accumulation of static electricity caused by dynamic contact friction. The apparatus comprises a belt, at least one motor, at least one spray nozzle, at least one dispenser or controller and at least one photo switch. The integrated circuits are placed on the belt. The motor drives the belt and therefore the integrated circuits step by step to the spray nozzle to coat the electrostatic agent on the surfaces of the integrated circuits. The controller controls the output rate of the electrostatic agent from the spray nozzle. The photo switch is connected to the spray nozzle and dispenser to detect the integrated circuits as they pass the spray nozzle.

Abstract: An apparatus is adapted for picking-up an integrated circuit component and is adapted to be connected to an air pump. The apparatus includes a retaining block formed with a first pipe hole and a washer receiving recess for receiving a washer. An air pipe is formed with a radially and outwardly extending rim flange at a junction of upper and lower pipe sections thereof. The lower pipe section extends sealingly through a second pipe hole in the washer and further through the first pipe hole such that the rim flange rests on top of the washer in the washer receiving recess, such that a distal lower end of the lower pipe section projects downwardly relative to the retaining block, and such that a distal upper end of the upper pipe section extends outwardly of the washer receiving recess and projects upwardly relative to the retaining block.

Abstract: A welding device includes a number of welding members disposed on a bases and a frame slidably supported in the base for supporting wires to be welded together. A moving device may move the frame between the welding members for allowing the wires to be welded together by the welding members. A removing device may remove the wires from the frame after the wires are welded together. An elevating device may elevate the frame for allowing the other frame to be moved through the frame and for allowing the other wires to be welded together by the welding members.