Patents by Inventor Ching K. Tai

Ching K. Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a package-ready light-sensitive integrated circuit
    Patent number: 7271029
    Abstract: A package-ready light-sensitive integrated circuit and process for preparing a light-sensitive semiconductor substrate for packaging that provide for a reduced exposure of a light-sensitive integrated circuit to light. The package-ready light-sensitive integrated circuit includes a semiconductor substrate (e.g., a silicon wafer) with an upper surface and a lower surface and lateral edges, an individual light-sensitive integrated circuit formed in and on the upper surface of the semiconductor substrate, and an opaque material layer covering the lower surface and lateral edges of the semiconductor substrate. The opaque material layer prevents light from entering the semiconductor substrate and interfering with operation of the light-sensitive integrated circuit. The process includes first providing at least one semiconductor substrate with a plurality of light-sensitive integrated circuits formed in and on its upper surface.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: September 18, 2007
    Assignee: National Semiconductor Corporation
    Inventor: Ching K. Tai
  • Package-ready light-sensitive integrated circuit and method for its preparation
    Patent number: 6876052
    Abstract: A package-ready light-sensitive integrated circuit and process for preparing a light-sensitive semiconductor substrate for packaging that provide for a reduced exposure of a light-sensitive integrated circuit to light. The package-ready light-sensitive integrated circuit includes a semiconductor substrate (e.g., a silicon wafer) with an upper surface and a lower surface and lateral edges, an individual light-sensitive integrated circuit formed in and on the upper surface of the semiconductor substrate, and an opaque material layer covering the lower surface and lateral edges of the semiconductor substrate. The opaque material layer prevents light from entering the semiconductor substrate and interfering with operation of the light-sensitive integrated circuit. The process includes first providing at least one semiconductor substrate with a plurality of light-sensitive integrated circuits formed in and on its upper surface.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: April 5, 2005
    Assignee: National Semiconductor Corporation
    Inventor: Ching K. Tai