Patents by Inventor Ching-Kai CHU

Ching-Kai CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180267083
    Abstract: A microelectromechanical probe has tail, head and body portions, and includes a pinpoint layer having a planarized top surface where a structural layer having first and second sides, a cutting face and a front terminal surface adjoining the first and second sides is disposed. The cutting face descends from the top surface of the structural layer toward the pinpoint layer to the front terminal surface. The front terminal surface extends from a front end of the cutting face to the top surface of the pinpoint layer. The pinpoint layer has a pinpoint protruding over the front terminal surface and located at the head portion. Within the head portion, the pinpoint layer is greater in hardness and less in electrical conductivity than the structural layer. The probe makes small probing marks, is highly recognizable in an automatic pinpoint recognition process, and can be conveniently installed.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 20, 2018
    Inventors: Shao-Lun WEI, Yu-Chen HSU, Mao-Fa SHEN, Neng-Hsuan KUO, Chien-Yu LIN, Ching-Kai CHU