Patents by Inventor Ching Kean CHIA

Ching Kean CHIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200209495
    Abstract: The present disclosure provides a communication system, a sensing device, and a semiconductor device, among other things. One example of the disclosed sensing device includes a semiconductor die having a photodetector. an optical element optically coupled to and disposed on the photodetector, at least one support structure substantially surrounding the optical element, and a top metal portion disposed on the semiconductor die adjacent to but distanced away from the optical element and the at least one support structure.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Inventors: Gim Hong Koh, Ramana Murty, Ching Kean Chia
  • Patent number: 10649156
    Abstract: The present disclosure provides a communication system, a sensing device, and a semiconductor device, among other things. One example of the disclosed sensing device includes a semiconductor die having a photodetector, an optical element optically coupled to and disposed on the photodetector, at least one support structure substantially surrounding the optical element, and a top metal portion disposed on the semiconductor die adjacent to but distanced away from the optical element and the at least one support structure.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: May 12, 2020
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Gim Hong Koh, Ramana Murty, Ching Kean Chia
  • Publication number: 20180182906
    Abstract: The present disclosure provides a communication system, a sensing device, and a semiconductor device, among other things. One example of the disclosed sensing device includes a semiconductor die having a photodetector, an optical element optically coupled to and disposed on the photodetector, at least one support structure substantially surrounding the optical element, and a top metal portion disposed on the semiconductor die adjacent to but distanced away from the optical element and the at least one support structure.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 28, 2018
    Inventors: Gim Hong Koh, Ramana Murty, Ching Kean Chia
  • Patent number: 9041136
    Abstract: According to one aspect, there is provided an avalanche photodiode comprising a first semiconductor layer that absorbs photons of a first wavelength range and having a first energy bandgap; a second semiconductor layer that absorbs photons of a second wavelength range and having a second energy bandgap, the second energy bandgap being different from the first energy bandgap; and a control layer between the first semiconductor layer and the second semiconductor layer, the control layer having a third energy bandgap engineered to suppress carriers created from dark current.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: May 26, 2015
    Assignee: Agency for Science, Technology and Research
    Inventor: Ching Kean Chia
  • Publication number: 20140319638
    Abstract: According to one aspect, there is provided an avalanche photodiode comprising a first semiconductor layer that absorbs photons of a first wavelength range and having a first energy bandgap; a second semiconductor layer that absorbs photons of a second wavelength range and having a second energy bandgap, the second energy bandgap being different from the first energy bandgap; and a control layer between the first semiconductor layer and the second semiconductor layer, the control layer having a third energy bandgap engineered to suppress carriers created from dark current.
    Type: Application
    Filed: October 19, 2012
    Publication date: October 30, 2014
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventor: Ching Kean Chia
  • Publication number: 20110284926
    Abstract: An avalanche photodiode structure, to a method of fabricating an avalanche photodiode structure, and to devices incorporating an avalanche photodiode structure. The avalanche photodiode structure comprises a Ge doped region having a first polarity; a GaAs doped region having a second polarity opposite to the first polarity; and an undoped region between the Ge doped region and the GaAs doped region forming a heterojunction; wherein the undoped region comprises Ge and AlxGa1-xAs.
    Type: Application
    Filed: May 18, 2011
    Publication date: November 24, 2011
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventor: Ching Kean Chia
  • Publication number: 20090220782
    Abstract: A method of forming gallium arsenide (GaAs)-on-insulator includes providing a substrate and forming a diffusion barrier layer of a compound of formula AlxGa1-xAs on the substrate. A layer of GaAs is formed on the diffusion barrier layer of AlxGa1-xAs. The layer of AlxGa1-xAs is substantially completely oxidized to transform the layer of AlxGa1-xAs into an electrical insulator as well as a diffusion barrier.
    Type: Application
    Filed: February 19, 2009
    Publication date: September 3, 2009
    Applicant: Agency for Science, Technology and Research
    Inventors: Ching Kean CHIA, Dongzhi CHI, Jianrong DONG, Aaditya SRIDHARA