Patents by Inventor CHING-KUANG WANG

CHING-KUANG WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip and configuration adjustment method for the same
    Patent number: 11133280
    Abstract: An integrated circuit chip includes a core circuit, a first bond pad, a first switch circuit, a second configuration resistor, a control circuit, and a storage unit. The first bonding pad is coupled to a first external reference voltage through a first node, and the first node is coupled to the first external reference voltage through a bonding wire or a first configuration resistor. The first switch circuit is coupled between a first internal reference voltage and the first node. The second configuration resistor is coupled between the first internal reference voltage and the first switch circuit or between the first switch circuit and the first node. In a first mode, the control circuit turns on the first switch circuit, and writes a configuration state of the first bonding pad to the storage unit. In a second mode, the control circuit turns off the first switch circuit.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: September 28, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chung-Chang Lin, Ching-Kuang Wang
  • INTEGRATED CIRCUIT CHIP AND CONFIGURATION ADJUSTMENT METHOD FOR THE SAME
    Publication number: 20200312809
    Abstract: An integrated circuit chip includes a core circuit, a first bond pad, a first switch circuit, a second configuration resistor, a control circuit, and a storage unit. The first bonding pad is coupled to a first external reference voltage through a first node, and the first node is coupled to the first external reference voltage through a bonding wire or a first configuration resistor. The first switch circuit is coupled between a first internal reference voltage and the first node. The second configuration resistor is coupled between the first internal reference voltage and the first switch circuit or between the first switch circuit and the first node. In a first mode, the control circuit turns on the first switch circuit, and writes a configuration state of the first bonding pad to the storage unit. In a second mode, the control circuit turns off the first switch circuit.
    Type: Application
    Filed: November 1, 2019
    Publication date: October 1, 2020
    Inventors: CHUNG-CHANG LIN, CHING-KUANG WANG