Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: The present invention relates to a method for producing recombinant human prethrombin-2 protein and having human ?-thrombin activity by the plant-based expression systems.

Abstract: A custom assembly light-emitting module using plugs and jacks for obtaining vertical electrical connections, includes a light-emitting unit, a lens unit, a plug unit and a jack unit. The lens unit is detachably combined with the light-emitting unit. The plug unit is disposed beside one side of the lens unit and electrically connected with the light-emitting unit. The jack unit is disposed on a bottom side of the plug unit and electrically connected with the plug unit. In addition, the light-emitting unit has two first retaining structures being formed on two opposite lateral sides thereof, the lens unit has a hollow transparent structure and a lens integratedly with the hollow transparent structure, two second retaining structures are disposed in the hollow transparent structure, and the light-emitting unit is detachably disposed in the hollow transparent structure.

Abstract: A custom assembly light-emitting module using plugs and jacks for obtaining vertical electrical connections, includes a light-emitting unit, a lens unit, a plug unit and a jack unit. The lens unit is detachably combined with the light-emitting unit. The plug unit is disposed beside one side of the lens unit and electrically connected with the light-emitting unit. The jack unit is disposed on a bottom side of the plug unit and electrically connected with the plug unit. In addition, the light-emitting unit has two first retaining structures being formed on two opposite lateral sides thereof, the lens unit has a hollow transparent structure and a lens integratedly with the hollow transparent structure, two second retaining structures are disposed in the hollow transparent structure, and the light-emitting unit is detachably disposed in the hollow transparent structure.

Abstract: A LED lamp comprises: a lamp base; an illuminating component, mounted on the lamp base, wherein the illuminating component comprises a circuit board and a plurality of LEDs arranged on the circuit board; a lamp shade, mounted on the lamp shade for enclosing the illuminating element, wherein the lamp shade has at least one open area; and at least one waterproof and ventilative element, disposed on the open area for covering the open area; thereby, vapors inside the lamp shade can vacate out of the LED lamp through the waterproof and ventilative element, while external vapors cannot infiltrate into the lamp shade through the waterproof and ventilative element.