Patents by Inventor Ching-Kuo Hsu

Ching-Kuo Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10566279
    Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: February 18, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen-Long Lu, Jen-Kuang Fang, Min Lung Huang, Chan Wen Liu, Ching Kuo Hsu
  • Patent number: 10424539
    Abstract: A wiring structure includes a main body, a first dielectric layer, a first circuit layer and a second dielectric layer. The first dielectric layer is disposed on the main body, and defines a plurality of first grooves and at least one receiving portion between two first grooves. The first circuit layer is disposed on the first dielectric layer, and includes at least one first conductive trace disposed on the receiving portion. A width of the first conductive trace is less than a width of the receiving portion. A second dielectric layer disposed on the first dielectric layer, and extends into the first grooves.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: September 24, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen-Long Lu, Ching Kuo Hsu
  • Publication number: 20190229054
    Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.
    Type: Application
    Filed: January 25, 2018
    Publication date: July 25, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen-Long LU, Jen-Kuang FANG, Min Lung HUANG, Chan Wen LIU, Ching Kuo HSU
  • Publication number: 20180174954
    Abstract: A wiring structure includes a main body, a first dielectric layer, a first circuit layer and a second dielectric layer. The first dielectric layer is disposed on the main body, and defines a plurality of first grooves and at least one receiving portion between two first grooves. The first circuit layer is disposed on the first dielectric layer, and includes at least one first conductive trace disposed on the receiving portion. A width of the first conductive trace is less than a width of the receiving portion. A second dielectric layer disposed on the first dielectric layer, and extends into the first grooves.
    Type: Application
    Filed: December 21, 2016
    Publication date: June 21, 2018
    Inventors: Wen-Long LU, Ching Kuo HSU
  • Publication number: 20160296814
    Abstract: A ball serving apparatus for pet including a housing, a rail assembly, and a launch module is provided. The housing has an inlet and an outlet. The rail assembly assembled in the housing is connected to the inlet. The launch module is assembled in the housing and connected between the rail assembly and the outlet. A ball is suitable for being put into the inlet to move in the rail assembly by gravity continuously. After moving to the launch module, the ball is launched out of the housing through the outlet by being driven by the launch module.
    Type: Application
    Filed: April 11, 2016
    Publication date: October 13, 2016
    Inventors: Ching-Kuo Hsu, Chih-Hong Wang, I-Lun Kuo