Patents by Inventor Ching-Lan Lin

Ching-Lan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9402134
    Abstract: A stiffened diaphragm manufacturing method and the manufactured diaphragm using same are provided. The manufacturing method includes the steps of: applying a hot glue layer to a side of a stiffened plate; putting a base layer on the hot glue layer, and then heating and adhering the base layer and the stiffened plate together; and performing a pressing process on the base layer and the stiffened plate to form a diaphragm having a central portion and a surround portion. The stiffened plate is coated uniformly with the hot glue layer and then put on the base layer to undergo heating and adhesion; hence, an oversupply or undersupply of a glue will be unlikely to happen. Furthermore, the manufacturing process is simple and attains high-strength adhesion between the stiffened plate and the base layer.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: July 26, 2016
    Assignee: MERRY ELECTRONICS (SUZHOU) CO., LTD.
    Inventors: Chen-Mao Yang, Ching-Lan Lin, Po-Yu Chen, Yi-Lin Hsieh, Feng-Min Lai
  • Publication number: 20160088394
    Abstract: A stiffened diaphragm manufacturing method and the manufactured diaphragm using same are provided. The manufacturing method includes the steps of: applying a hot glue layer to a side of a stiffened plate; putting a base layer on the hot glue layer, and then heating and adhering the base layer and the stiffened plate together; and performing a pressing process on the base layer and the stiffened plate to form a diaphragm having a central portion and a surround portion. The stiffened plate is coated uniformly with the hot glue layer and then put on the base layer to undergo heating and adhesion; hence, an oversupply or undersupply of a glue will be unlikely to happen. Furthermore, the manufacturing process is simple and attains high-strength adhesion between the stiffened plate and the base layer.
    Type: Application
    Filed: September 19, 2014
    Publication date: March 24, 2016
    Inventors: Chen-Mao YANG, Ching-Lan LIN, Po-Yu CHEN, Yi-Lin HSIEH, Feng-Min LAI
  • Patent number: 9173033
    Abstract: A composite vibration diaphragm fabrication method includes the steps of: (a) mixing a reinforcing material with a hot melt adhesive to form a first mixture and to let the reinforcing material be wrapped in the hot melt adhesive uniformly, (b) mixing the first mixture with a thermosetting adhesive to form a second mixture, (c) coating the second mixture on a vibration diaphragm material and then heating the second mixture coated vibration diaphragm material, and (d) cooling down the coated vibration diaphragm material in which the second mixture is cured and bonded to the vibration diaphragm material. Thus, when baking the second mixture, the internal hot melt adhesive will be melted and integrated with the thermosetting adhesive, and the thermosetting adhesive will also be cured, enabling the reinforcing material to be uniformly bonded to the vibration diaphragm to reinforce the strength and rigidity of the composite vibration diaphragm.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: October 27, 2015
    Assignee: MERRY ELECTRONICS (SUZHOU) CO., LTD.
    Inventors: Ching-Lan Lin, Chen-Mao Yang, Po-Yu Chen, Feng-Min Lai
  • Publication number: 20150256937
    Abstract: A composite diaphragm is provided to include a base layer and a micro-nanometer ceramic layer disposed on the surface of the base layer. The micro-nanometer ceramic is a structural material that has great stiffness and toughness, such that the composite diaphragm made of micro-nanometer ceramic manifests characteristics of high stiffness, high toughness, and great ductility. Thus, the composite diaphragm allows large deformation at room temperature to achieve high capability of producing high-definition tone.
    Type: Application
    Filed: June 18, 2014
    Publication date: September 10, 2015
    Inventors: Ching-Lan LIN, Chen-Mao YANG, Po-Yu CHEN, Yi-Lin HSIEH, Feng-Min LAI
  • Publication number: 20150136518
    Abstract: Provided is a composite diaphragm which includes a base layer and at least a graphyne including layer. The base layer has a central portion and a peripheral portion disposed at the periphery of the central portion. The graphyne including layer is disposed on the surface of the base layer. As graphyne is a lightweight and highly rigid material with a two-dimensional structure, composite diaphragms made of graphyne manifest characteristics, such as high stiffness, high toughness and low density, and thus achieve high practicability, such as high durability and high capability of producing high-definition tone.
    Type: Application
    Filed: January 9, 2014
    Publication date: May 21, 2015
    Applicant: MERRY ELECTRONICS (SUZHOU) CO., LTD.
    Inventors: Ching-Lan LIN, Chen-Mao YANG, Wen-Hong WANG
  • Publication number: 20110194723
    Abstract: An exemplary magnetic diaphragm is applied to an electro-acoustic transducer. The magnetic diaphragm has a base formed with a magnetic layer thereon by a film deposition method. The base with the magnetic layer thus has magnetism to interference with a magnetic circuit of the electro-acoustic transducer. A manufacture method of the magnetic diaphragm is also disclosed.
    Type: Application
    Filed: February 10, 2010
    Publication date: August 11, 2011
    Inventors: Ching-Lan Lin, Hong-Ching Her
  • Publication number: 20100236861
    Abstract: A diaphragm of an electro-acoustic transducer is provided. The diaphragm of the electro-acoustic transducer includes a central portion and a peripheral portion. The rigidity of the central portion is greater than the peripheral portion, such that the diaphragm has different rigidity characteristics, and thus gets better high-frequency performance and better sensitivity.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 23, 2010
    Applicant: MERRY ELECTRONICS CO., LTD.
    Inventors: Hong-Ching Her, Ching-Lan Lin