Patents by Inventor Ching-Li Wu

Ching-Li Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10688707
    Abstract: A system and method for forming fluted polymer boards and recycling scrap material. A feeder feeds polymer to an extruder, which extrudes fluted board stock from the polymer. A scrap portion of the board stock is separated from another portion that comes to form the boards. The recycling system returns the separated scrap portion along a return path to the feeder and forms holes in the scrap portion creating fluid communication between the flutes and atmosphere before the scrap portion is returned to the feeder. The scrap portion can, in some embodiments, be ground into granular form after being hole-punched without creating a pressure condition in the flutes that adversely affects extrusion of the board stock.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: June 23, 2020
    Assignee: Inteplast Group Corporation
    Inventors: Phillip Ching-Li Wu, Ronald E. Summers
  • Publication number: 20190091911
    Abstract: A system and method for forming fluted polymer boards and recycling scrap material. A feeder feeds polymer to an extruder, which extrudes fluted board stock from the polymer. A scrap portion of the board stock is separated from another portion that comes to form the boards. The recycling system returns the separated scrap portion along a return path to the feeder and forms holes in the scrap portion creating fluid communication between the flutes and atmosphere before the scrap portion is returned to the feeder. The scrap portion can, in some embodiments, be ground into granular form after being hole-punched without creating a pressure condition in the flutes that adversely affects extrusion of the board stock.
    Type: Application
    Filed: September 25, 2017
    Publication date: March 28, 2019
    Applicant: Inteplast Group Corporation
    Inventors: Phillip Ching-Li Wu, Ronald E. Summers
  • Publication number: 20080009183
    Abstract: The present invention discloses a high density module connector that includes a combining base, a plurality of connectors and a packaging module. A high density module connector is used to substitute a circuit board of a traditional patch panel, so as to overcome the shortcoming of replacing the whole circuit board when a certain wire clamp groove on the circuit board fails. If a connector in the high density module connector fails, it is necessary to change the connector only for the patch panel to be operated normally again. The high density module connector can separate the circuits and reduce the interference caused by the densely installed circuits effectively.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 10, 2008
    Inventor: Ching-Li Wu
  • Patent number: 7288007
    Abstract: This invention relates to a type of improved connecting socket, comprising an external casing, wherein both ends have a through hole each, and a connecting unit installed at the external casing, wherein the connecting unit comprises a circuit board which has at least two connectors on it, and the sockets at the two connectors are respectively located at the two ends of the circuit board, and correspond to the through holes of the aforesaid external casing. Based on this, the connecting socket can be firmly attached to a predetermined position and serve as a socket for connecting the wire of the electronic product, and which can also be used independently as an adaptor socket for an extension wire set-up.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: October 30, 2007
    Assignee: Hsing Chau Industrial Co., Ltd.
    Inventor: Ching-Li Wu
  • Publication number: 20070197057
    Abstract: This invention relates to a type of improved connecting socket, comprising an external casing, wherein both ends have a through hole each, and a connecting unit installed at the external casing, wherein the connecting unit comprises a circuit board which has at least two connectors on it, and the sockets at the two connectors are respectively located at the two ends of the circuit board, and correspond to the through holes of the aforesaid external casing. Based on this, the connecting socket can be firmly attached to a predetermined position and serve as a socket for connecting the wire of the electronic product, and which can also be used independently as an adaptor socket for an extension wire set-up.
    Type: Application
    Filed: February 17, 2006
    Publication date: August 23, 2007
    Inventor: Ching-Li Wu