Abstract: An aluminum adhering process and a vacuum transfer chamber for a metal thin film plating machine. The vacuum transfer chamber includes a vacuum transfer chamber and a pre etching reacting cavity installed in a periphery of and communicated to the vacuum transfer chamber. The pre etching reacting cavity is in a very high vacuum state. The vacuum transfer chamber is installed with a robot. The aluminum adhering process includes steps of: installing a locating frame in the vacuum transfer chamber and for storing an aluminum sheet; taking the aluminum sheet from the locating sheet then transferring the aluminum sheet to the pre etching reaction chamber; plasma bombarding the aluminum sheet in the pre etching reaction chamber; and transferring the aluminum sheet back to the locating frame after a layer of aluminum is plated on an inner wall of the pre etching reacting cavity.