Patents by Inventor Ching-Liang Kao

Ching-Liang Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220319909
    Abstract: The present disclosure provides a method for manufacturing a semiconductor memory device. Because the present method includes applying a dopant-implanted layer on a semiconductor memory substrate before growing a silicon nitride layer on the substrate, the silicon nitride layer can be grown at an increased rate. The present disclosure avoids a problem encountered in the prior art wherein a seam having a greater length contacts an edge of a contact plug of a semiconductor memory device. Hence, a leakage problem at subsequent operations of semiconductor manufacture can be avoided, and the product yield can be significantly improved.
    Type: Application
    Filed: April 1, 2021
    Publication date: October 6, 2022
    Inventors: CHING-LIANG KAO, WEN-CHIEH WU, LI-LING KE
  • Publication number: 20220293650
    Abstract: A semiconductor device includes a plurality of isolation structures, wherein each isolation structure of the plurality of isolation structures is spaced from an adjacent isolation structure of the plurality of isolation structures in a first direction. The semiconductor device further includes a gate structure. The gate structure includes a top surface; a first sidewall angled at a non-perpendicular angle with respect to the top surface; and a second sidewall angled with respect to the top surface. The gate structure further includes a first horizontal surface extending between the first sidewall and the second sidewall, wherein the first horizontal surface is parallel to the top surface, and a dimension of the gate structure in a second direction, perpendicular to the first direction, is less than a dimension of each of the plurality of isolation structures in the second direction.
    Type: Application
    Filed: June 2, 2022
    Publication date: September 15, 2022
    Inventors: Chia-Yu WEI, Fu-Cheng CHANG, Hsin-Chi CHEN, Ching-Hung KAO, Chia-Pin CHENG, Kuo-Cheng LEE, Hsun-Ying HUANG, Yen-Liang LIN
  • Patent number: 11380721
    Abstract: A gate structure includes a gate and a first isolation structure having a top surface and a bottom surface. The gate includes a first sidewall adjacent to the first isolation structure, a second sidewall, a first horizontal surface adjacent to a bottom edge of the first sidewall and a bottom edge of the second sidewall, the first horizontal surface being between the top surface of the first isolation structure and the bottom surface of the first isolation structure. The gate also includes a second horizontal surface adjacent to a top edge of the second sidewall. An effective channel width defined by the gate structure includes a height of the second sidewall and a width of the second horizontal surface.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: July 5, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng, Kuo-Cheng Lee, Hsun-Ying Huang, Yen-Liang Lin
  • Patent number: 6686218
    Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: February 3, 2004
    Assignee: Opto Tech Corporation
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Patent number: 6603151
    Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: August 5, 2003
    Assignee: Opto Tech Corporation
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Publication number: 20030100140
    Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Application
    Filed: January 15, 2003
    Publication date: May 29, 2003
    Applicant: OPTO TECH CORPORATION
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Publication number: 20020131726
    Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 19, 2002
    Applicant: OPTO TECH CORPORATION
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang