Patents by Inventor Ching-Liang Weng
Ching-Liang Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11870306Abstract: A wave energy conversion device includes a permanent magnet generator, a first driving component and a second driving component. The permanent magnet generator includes a stator structure and a rotor structure. The stator structure includes a stator body. The rotor structure includes a rotor body. The rotor body is disposed inside the stator body in a swinging manner or in a rotatable manner. The first driving component is coupled to the rotor structure. The second driving component is coupled to the stator structure. The wave energy conversion device of the present invention requires a low speed/angle of a swinging/rotating movement of the rotor body relative to the stator body to generate electricity, which facilitates electricity generation from wave energy.Type: GrantFiled: July 12, 2021Date of Patent: January 9, 2024Assignee: FLH Energy Technology Ltd.Inventor: Ching-Liang Weng
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Patent number: 11719217Abstract: A multi-axial wave energy conversion device includes a carrier, a main body coupled to the carrier, a wave energy conversion assembly, a rotating mechanism, a lifting mechanism and a control unit electrically connected to the rotating mechanism and the lifting mechanism. The wave energy conversion assembly is coupled to the main body and includes an arm. The rotating mechanism is coupled between the carrier and the main body. The lifting mechanism is coupled between the arm and the main body. The control unit is for controlling the rotating mechanism to drive the main body to rotate relative to the carrier around a vertical axis for adjusting an orientation of the arm relative to the carrier, and further for controlling the lifting mechanism to drive the arm to rotate relative to the main body around a horizontal axis for adjusting an included angle between the arm and the main body.Type: GrantFiled: April 5, 2022Date of Patent: August 8, 2023Assignee: FLH Energy Technology Ltd.Inventor: Ching-Liang Weng
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Publication number: 20230175470Abstract: A multi-axial wave energy conversion device includes a carrier, a main body coupled to the carrier, a wave energy conversion assembly, a rotating mechanism, a lifting mechanism and a control unit electrically connected to the rotating mechanism and the lifting mechanism. The wave energy conversion assembly is coupled to the main body and includes an arm. The rotating mechanism is coupled between the carrier and the main body. The lifting mechanism is coupled between the arm and the main body. The control unit is for controlling the rotating mechanism to drive the main body to rotate relative to the carrier around a vertical axis for adjusting an orientation of the arm relative to the carrier, and further for controlling the lifting mechanism to drive the arm to rotate relative to the main body around a horizontal axis for adjusting an included angle between the arm and the main body.Type: ApplicationFiled: April 5, 2022Publication date: June 8, 2023Applicant: FLH Energy Technology Ltd.Inventor: Ching-Liang Weng
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Publication number: 20220224211Abstract: A multi-axial wave energy conversion device includes a main body and a plurality of permanent magnet generating assemblies. Each permanent magnet generating assembly includes at least one permanent magnet generator, an arm and a driving component. The at least one permanent magnet generator includes a stator structure and a rotor structure capable of rotating or swinging relative to the stator structure. The at least one permanent magnet generator is disposed or coupled between the main body and the arm or disposed or coupled between the arm and the driving component, so that the rotor structure is driven to rotate or swing relative to the stator structure when the arm moves relative to the main body or the driving component moves relative to the arm.Type: ApplicationFiled: October 8, 2021Publication date: July 14, 2022Applicant: FLH Energy Technology Ltd.Inventor: Ching-Liang Weng
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Publication number: 20220220931Abstract: A wave energy conversion device includes a permanent magnet generator, a first driving component and a second driving component. The permanent magnet generator includes a stator structure and a rotor structure. The stator structure includes a stator body. The rotor structure includes a rotor body. The rotor body is disposed inside the stator body in a swinging manner or in a rotatable manner. The first driving component is coupled to the rotor structure. The second driving component is coupled to the stator structure. The wave energy conversion device of the present invention requires a low speed/angle of a swinging/rotating movement of the rotor body relative to the stator body to generate electricity, which facilitates electricity generation from wave energy.Type: ApplicationFiled: July 12, 2021Publication date: July 14, 2022Applicant: FLH Energy Technology Ltd.Inventor: Ching-Liang Weng
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Patent number: 8058956Abstract: A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.Type: GrantFiled: June 21, 2010Date of Patent: November 15, 2011Assignee: Industrial Technology Research InstituteInventors: Uei-Ming Jow, Ching-Liang Weng, Ying-Jiunn Lai, Chang-Sheng Chen
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Patent number: 7994885Abstract: A switch module consists of a build-up multi-layer structure and some passive devices. The build-up multi-layer structure has multitudes of conductive layers and dielectric layers laminated upon each another. At least one dielectric layer is interfered between any two conductive layers. Any one passive device is a portion of at least one conductive layer and electrically connects multitudes of conductive pads on the surface of the build-up multi-layer structure.Type: GrantFiled: August 20, 2010Date of Patent: August 9, 2011Assignee: Industrial Technology Research InstituteInventors: Chang-Lin Wei, Ching-Liang Weng, Uei-Ming Jow, Ying-Jiunn Lai, Syun Yu, Chang-Sheng Chen
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Publication number: 20100314233Abstract: A switch module consists of a build-up multi-layer structure and some passive devices. The build-up multi-layer structure has multitudes of conductive layers and dielectric layers laminated upon each another. At least one dielectric layer is interfered between any two conductive layers. Any one passive device is a portion of at least one conductive layer and electrically connects multitudes of conductive pads on the surface of the build-up multi-layer structure.Type: ApplicationFiled: August 20, 2010Publication date: December 16, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: CHANG-LIN WEI, CHING-LIANG WENG, UEI-MING JOW, YING-JIUNN LAI, SYUN YU, CHANG-SHENG CHEN
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Publication number: 20100259338Abstract: A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.Type: ApplicationFiled: June 21, 2010Publication date: October 14, 2010Inventors: Uei-Ming Jow, Ching-Liang Weng, Ying-Jiunn Lai, Chang-Sheng Chen
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Patent number: 7446995Abstract: A symmetrical capacitor includes at least a first metal layer and a second metal layer. Each of the metal layers has a first electrode plate and a second electrode plate separated by a predetermined distance. The first electrode plates on the metal layers are symmetrical, and the second electrode plates on the metal layers are symmetrical. Given the symmetrical structure of the capacitor, the output ports of the capacitor have the same electrical features. Therefore, there will not be a direction problem when the capacitor is used, and the symmetrical electrical features are improved.Type: GrantFiled: February 27, 2006Date of Patent: November 4, 2008Assignee: Industrial Technology Research InstituteInventors: Uei-Ming Jow, Ying-Jiunn Lai, Chang-Sheng Chen, Ching-Liang Weng
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Publication number: 20070025052Abstract: A symmetrical capacitor includes at least a first metal layer and a second metal layer. Each of the metal layers has a first electrode plate and a second electrode plate separated by a predetermined distance. The first electrode plates on the metal layers are symmetrical, and the second electrode plates on the metal layers are symmetrical. Given the symmetrical structure of the capacitor, the output ports of the capacitor have the same electrical features. Therefore, there will not be a direction problem when the capacitor is used, and the symmetrical electrical features are improved.Type: ApplicationFiled: February 27, 2006Publication date: February 1, 2007Inventors: Uei-Ming Jow, Ying-Jiunn Lai, Chang-Sheng Chen, Ching-Liang Weng
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Patent number: 7102874Abstract: The present invention describes an intermediate for use in a capacitive printed circuit board (PCB), which relates to a capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode used to reduce inaccuracy of the error compression alignment on laminates. The invention employs a plurality of different sized metal laminates stacked for a built-in capacitor to achieve a high-precise capacitor PCB. More particularly, the invention can raise the capability of noise-immunity of a capacitive PCB applied to high frequency/speed modules and systems, and also provides precise capacitance to regular circuit design for the need of compact package and high-precise capacitance in the future.Type: GrantFiled: July 21, 2004Date of Patent: September 5, 2006Assignee: Industrial Technology Research InstituteInventors: Uei-Ming Jow, Ying-Jiunn Lai, Chun-Kun Wu, Pel-Shen Wei, Chang-Sheng Chen, Ching-Liang Weng
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Publication number: 20060176123Abstract: A switch module consists of a build-up multi-layer structure and some passive devices. The build-up multi-layer structure has multitudes of conductive layers and dielectric layers laminated upon each another. At least one dielectric layer is interfered between any two conductive layers. Any one passive device is a portion of at least one conductive layer and electrically connects multitudes of conductive pads on the surface of the build-up multi-layer structure.Type: ApplicationFiled: June 20, 2005Publication date: August 10, 2006Inventors: Chang-Lin Wei, Ching-Liang Weng, Uei-Ming Jow, Ying-Jiunn Lai, Syun Yu, Chang-Sheng Chen
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Publication number: 20060158280Abstract: A high frequency and wide band impedance matching via is provided. As an application to multi-layer printed circuit boards, for example, the multi-layer circuit board has several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers are sited on different circuit layers, and each signal transmission trace is opposite to one of the ground layers. The signal transmission vias are connected between the signal transmission traces. The ground vias are connected between the ground layers. The ground vias are opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias are sited to stabilize the characteristic impedance of the transmission traces.Type: ApplicationFiled: October 11, 2005Publication date: July 20, 2006Inventors: Uei-Ming Jow, Ching-Liang Weng, Ying-Jiunn Lai, Chang-Sheng Chen
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Patent number: 7068122Abstract: A miniaturized multi-layer balun includes a pair of capacitive elements, at least one section of broadside coupled lines connected in series to an unbalanced and two balanced ports through a pair of transmission lines. Each section has first and second coupled lines. A ground connection is located between two central second coupled lines, and connected to a ground. By means of a multi-layer structure and the addition of a ground connection, the balun of the invention can be fabricated with five conductor layers. This not only greatly decreases the size of the balun device, but also enhances the stability of the device. From the measured return loss and differences in magnitude and phase to the frequency response, it shows that the balun of the invention has good impedance match.Type: GrantFiled: September 28, 2004Date of Patent: June 27, 2006Assignee: Industrial Technology Research InstituteInventors: Ching-Liang Weng, Chang-Sheng Chen, Ying-Jiunn Lai, Uei-Ming Jow, Chin-Sun Shyu
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Publication number: 20060066415Abstract: A miniaturized multi-layer balun includes a pair of capacitive elements, at least one section of broadside coupled lines connected in series to a unbalanced and two balanced ports through a pair of transmission lines. Each section has first and second coupled lines. A ground connection is located between two central second coupled lines, and connected to a ground. By means of a multi-layer structure and the addition of a ground connection, the balun of the invention can be fabricated with five conductor layers. This not only greatly decreases the size of the balun device, but also enhances the stability of the device. From the measured return loss and differences in magnitude and phase to the frequency response, it shows that the balun of the invention has good impedance match.Type: ApplicationFiled: September 28, 2004Publication date: March 30, 2006Inventors: Ching-Liang Weng, Chang-Sheng Chen, Ying-Jiunn Lai, Uei-Ming Jow, Chin-Sun Shyu
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Patent number: 6969912Abstract: An embedded microelectronic capacitor incorporating at least one ground shielding layer is provided which includes an upper ground shielding layer that has an aperture therethrough; an electrode plate positioned spaced-apart from the upper ground shielding layer that has a via extending upwardly away from the electrode plate through the aperture in the upper ground shielding layer providing electrical communication to the electrode plate without shorting to the upper ground shielding layer; a middle ground shielding layer positioned in the same plane of the electrode plate, surrounding while spaced-apart from the electrode plate at a predetermined distance; a lower ground shielding layer positioned spaced-apart from the electrode plate in an opposing relationship to the upper ground shielding layer; and a dielectric material embedding the upper ground shielding layer; the middle ground shielding layer and the lower ground shielding layer.Type: GrantFiled: November 14, 2003Date of Patent: November 29, 2005Assignee: Industrial Technology Research InstituteInventors: Uei-Ming Jow, Pei-Shen Wei, Ching-Liang Weng, Chun-Kun Wu, Chang-Sheng Chen, Ying-Jiunn Lai
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Publication number: 20050168913Abstract: The present invention describes an intermediate for use in a capacitive printed circuit board (PCB), which relates to a capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode used to reduce inaccuracy of the error compression alignment on laminates. The invention employs a plurality of different sized metal laminates stacked for a built-in capacitor to achieve a high-precise capacitor PCB. More particularly, the invention can raise the capability of noise-immunity of a capacitive PCB applied to high frequency/speed modules and systems, and also provides precise capacitance to regular circuit design for the need of compact package and high-precise capacitance in the future.Type: ApplicationFiled: July 21, 2004Publication date: August 4, 2005Inventors: Uei-Ming Jow, Ying-Jiunn Lai, Chun-Kun Wu, Pel-Shen Wei, Chang-Sheng Chen, Ching-Liang Weng
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Publication number: 20050104191Abstract: An embedded microelectronic capacitor incorporating at least one ground shielding layer is provided which includes an upper ground shielding layer that has an aperture therethrough; an electrode plate positioned spaced-apart from the upper ground shielding layer that has a via extending upwardly away from the electrode plate through the aperture in the upper ground shielding layer providing electrical communication to the electrode plate without shorting to the upper ground shielding layer; a middle ground shielding layer positioned in the same plane of the electrode plate, surrounding while spaced-apart from the electrode plate at a predetermined distance; a lower ground shielding layer positioned spaced-apart from the electrode plate in an opposing relationship to the upper ground shielding layer; and a dielectric material embedding the upper ground shielding layer; the middle ground shielding layer and the lower ground shielding layer.Type: ApplicationFiled: November 14, 2003Publication date: May 19, 2005Inventors: Uei-Ming Jow, Pei-Shen Wei, Ching-Liang Weng, Chun-Kun Wu, Chang-Sheng Chen, Ying-Jiunn Lai
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Publication number: 20040218342Abstract: An embedded microelectronic capacitor equipped with geometrically-centered electrodes which includes an upper electrode plate of a first polarity; a middle electrode plate of a second polarity opposite to the first polarity; at least one lower electrode plate of the first polarity in electrical communication with the upper electrode plate through a center via. The center via is positioned at a distance from a geometric center of the middle electrode plate of not larger than 50% of the diameter of the plate, and preferably not larger than 30% of the diameter.Type: ApplicationFiled: April 30, 2003Publication date: November 4, 2004Applicant: Industrial Technology Research InstituteInventors: Wei-Ming Jow, Pei-Shen Wei, Ching-Liang Weng, Chun-Kun Wu, Chang-Sheng Chen