Abstract: An antenna-in-package construction includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant more than 3.5. The antenna-in-package construction includes a transmitting antenna array, a receiving antenna array, and metal isolated pillars. The transmitting antenna array extends from the chip layer to the first dielectric layer through the second dielectric layer. The receiving antenna array extends from the chip layer to the second dielectric layer. The transmitting antenna array and the receiving antenna array are arranged in an alternating interleaved sequence. The metal isolated pillars surround each transmitting antenna and each receiving antenna. The chip layer includes at least one transmitting chip and at least one receiving chip. The transmitting chip and the receiving chip are electrically connected to the transmitting antenna array and the receiving antenna array, respectively.

Abstract: A cassette for placing a glass substrate, which includes an upper frame, a lower frame the same as the upper frame, and four pillars standing between the upper and lower frames to form asapce. The cassette fabricated structure further includes a plurality of rib racks set up on lateral sides of the upper and lower frames, a plurality of ribs set up on the rib rack, and grooves formed by adjacent ribs for placing the glass substrate.