Patents by Inventor Ching-Lien Yeh
Ching-Lien Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8828755Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.Type: GrantFiled: August 22, 2013Date of Patent: September 9, 2014Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao
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Patent number: 8664840Abstract: An LED bulb includes a bulb body and an adapter detachably connecting with the bulb body. The bulb body has two pins function as a negative electrode and a positive electrode. The two pins are for inserting into and electrically connecting with a bi-pin socket connector for light bulb, such as MR16 socket connector. The adapter includes a junction seat, a first connector, a second connector, and a bulb cap. Metallic threads are formed on the bulb cap. The first connector is received in the junction seat and electrically contacts the threads. The second connector extends through the junction seat and the bulb cap to make a bottom end thereof being exposed. The adapter is able to engage and electrically connect with an Edison screw socket connector, for example, E-10 socket connector.Type: GrantFiled: December 21, 2012Date of Patent: March 4, 2014Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chia-Chen Chang, Chuan-Fu Yang
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Patent number: 8657469Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a housing enclosing the at lest one light module and the at least one lens therein, and a foldable cover located in front of the at least one lens and connected to the housing. A cleaning device is located on an outer surface of the foldable cover to clean snow and dust accumulated on the outer surface of the foldable cover.Type: GrantFiled: May 9, 2013Date of Patent: February 25, 2014Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chi-Wei Liao, Wen-Liang Tseng, Min-Tsun Hsieh, Chih-Yung Lin, Ching-Lien Yeh
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Publication number: 20140051193Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.Type: ApplicationFiled: August 22, 2013Publication date: February 20, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
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Publication number: 20130285530Abstract: An LED bulb includes a bulb body and an adapter detachably connecting with the bulb body. The bulb body has two pins function as a negative electrode and a positive electrode. The two pins are for inserting into and electrically connecting with a bi-pin socket connector for light bulb, such as MR16 socket connector. The adapter includes a junction seat, a first connector, a second connector, and a bulb cap. Metallic threads are formed on the bulb cap. The first connector is received in the junction seat and electrically contacts the threads. The second connector extends through the junction seat and the bulb cap to make a bottom end thereof being exposed. The adapter is able to engage and electrically connect with an Edison screw socket connector, for example, E-10 socket connector.Type: ApplicationFiled: December 21, 2012Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH, CHIA-CHEN CHANG, CHUAN-FU YANG
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Patent number: 8541799Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.Type: GrantFiled: May 23, 2011Date of Patent: September 24, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao
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Publication number: 20130242554Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a housing enclosing the at lest one light module and the at least one lens therein, and a foldable cover located in front of the at least one lens and connected to the housing. A cleaning device is located on an outer surface of the foldable cover to clean snow and dust accumulated on the outer surface of the foldable cover.Type: ApplicationFiled: May 9, 2013Publication date: September 19, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, MIN-TSUN HSIEH, CHIH-YUNG LIN, CHING-LIEN YEH
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Patent number: 8459838Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.Type: GrantFiled: October 8, 2010Date of Patent: June 11, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chi-Wei Liao, Wen-Liang Tseng, Min-Tsun Hsieh, Chih-Yung Lin, Ching-Lien Yeh
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Patent number: 8384276Abstract: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.Type: GrantFiled: June 24, 2011Date of Patent: February 26, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh
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Patent number: 8344406Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.Type: GrantFiled: December 17, 2010Date of Patent: January 1, 2013Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao, Jian-Shihn Tsang
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Publication number: 20120280639Abstract: A planar lighting module comprises a substrate, at least one light guide device and a driver. A frame is located on the substrate for fastening the at least one light guide device and the driver. By manipulation and binding, the planar lighting module can be easily assembled or dismantled, no screws or welded joints are used, and it is also convenient to service.Type: ApplicationFiled: November 20, 2011Publication date: November 8, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHIH-YUNG LIN, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHING-LIEN YEH, MIN-TSUN HSIEH, CHUAN-FU YANG
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Publication number: 20120074827Abstract: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.Type: ApplicationFiled: June 24, 2011Publication date: March 29, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH
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Publication number: 20120075858Abstract: An exemplary LED bulb includes a holder, a housing, a heat spreader, a power module and an LED module. The housing connects to the holder. The heat spreader detachably engages with the housing. The power module detachably engages with the housing and is received in the housing. The LED module is arranged on the heat spreader. The LED module electrically connects to the holder via the power module. The LED module is physically separated from the power module.Type: ApplicationFiled: June 29, 2011Publication date: March 29, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHUAN-FU YANG
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Publication number: 20120043576Abstract: An LED package structure includes a substrate with a concave groove therein, an LED die received in the concave groove, a heat conductive pillar, two electrically conductive pillars, a heat conductive plate, and two contact pads. The heat conductive pillar extends through the substrate and thermally connects with the LED die and the heat conductive plate. The electrically conductive pillars extend through substrate and electrically connect with the LED die, respectively. The electrically conductive pillars and the heat conductive pillar are spaced from each other. The contact pads respectively and electrically connect with the electrically conductive pillars. The contact pads are spaced from each other.Type: ApplicationFiled: March 9, 2011Publication date: February 23, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO, JIAN-SHIHN TSANG
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Publication number: 20120020089Abstract: An LED light bar includes an elongated circuit board, a first lighting module formed in the middle of the circuit board and two second light modules formed at two opposite ends of the circuit board. Each of first lighting module and the two second lighting module includes a plurality of LEDs arranged linearly on a surface of the circuit board. A density of the LEDs in the first lighting module is smaller than that in the second lighting modules.Type: ApplicationFiled: March 29, 2011Publication date: January 26, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
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Publication number: 20110297981Abstract: A fluorescent structure for a light-emitting package includes a first fluorescent layer and a second fluorescent layer covering the first fluorescent layer. The first fluorescent layer includes first fluorescent strips, and defines first transparent regions between the first fluorescent strips. The second fluorescent layer includes second fluorescent strips, and defines second transparent regions between the second fluorescent strips. A method for forming the fluorescent structure and a light-emitting diode package using the fluorescent structure are also provided.Type: ApplicationFiled: January 9, 2011Publication date: December 8, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH
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Publication number: 20110291138Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.Type: ApplicationFiled: May 23, 2011Publication date: December 1, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
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Publication number: 20110266570Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.Type: ApplicationFiled: December 17, 2010Publication date: November 3, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO, JIAN-SHIHN TSANG
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Publication number: 20110266574Abstract: An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.Type: ApplicationFiled: January 17, 2011Publication date: November 3, 2011Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH
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Patent number: D654444Type: GrantFiled: December 8, 2010Date of Patent: February 21, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Lung-Hsin Chen, Wen-Liang Tseng