Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: A detection system and method for the migrating cell is provided. The system is configured to detect a migrating cell combined with an immunomagnetic bead. The system includes a platform, a microchannel, a magnetic field source, a coherent light source and an optical sensing module. The microchannel is configured to allow the migrating cell to flow in it along a flow direction. The magnetic field source is configured to provide magnetic force to the migrating cell combined with the immunomagnetic bead. The magnetic force includes at least one magnetic force component and the magnetic force component is opposite to the flow direction of the microchannel. The coherent light source is configured to provide the microchannel with the coherent light. The optical sensing module is configured to receive the interference light caused by the coherent light being reflected by the sample inside the microchannel.

Abstract: A memory device is provided, including an array of bit cells and a set of tracking cells. The set of tracking cells is arranged adjacent to the array of bit cells along a first direction. The set of tracking cells includes a set of first tracking cells configured to perform a read tracking operation and a set of second tracking cells configured to perform a write tracking operation and arranged adjacent to the set of first tracking cells along a second direction. First tracking cells in the set of first tracking cells are coupled in series with each other and arranged along the second direction, and second tracking cells in the set of second tracking cells are coupled in series with each other and arranged along the second direction.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A coating is described. The coating includes a metal oxide layer, which in turn includes a surface having a water contact angle greater than 90 degrees. A metal-oxide coating composition is also described. The composition includes effective amounts of a first type and a second of metals and an effective amount of oxygen to react with the first type and the second type of metals to produce a first type and a second type of metal oxides, both of which produce a structure that is greater than about 50% (by volume) amorphous.

Abstract: An analysis method for a semiconductor device is described. The semiconductor device having an abnormal region is provided. Thereafter, a focused ion beam microscope analysis process is performed to the abnormal region, wherein the result of the focused ion beam microscope analysis process shows that the abnormal region has a defect therein. After the focused ion beam microscope analysis process, an electrical property measurement step is performed to the abnormal region, so as to determine whether the defect in the abnormal region is a device failure root cause or not.

Abstract: An analysis method for a semiconductor device is described. The semiconductor device having an abnormal region is provided. Thereafter, a focused ion beam microscope analysis process is performed to the abnormal region, wherein the result of the focused ion beam microscope analysis process shows that the abnormal region has a defect therein. After the focused ion beam microscope analysis process, an electrical property measurement step is performed to the abnormal region, so as to determine whether the defect in the abnormal region is a device failure root cause or not.

Abstract: An optical module box made of aluminum that has a reworkable glass-sealed fiber feedthru is disclosed. A fiber is inserted through a glass seal and a C-seal for hermetically sealing an opening in the optical module box. In a first embodiment, a module box employing a single-fiber fiber feedthru is described. In a second embodiment, a module box employing a 2-fiber feedthru is described. In a third embodiment, a module box employing a ribbon fiber feedthru is described. A module box having an opening with a single-fiber feedthru, comprising a C-seal; a glass sealed feedthru having a front tube and a back tube, the back tube of the glass sealed feedthru extending through the C-seal; and a fiber passing through the glass sealed feedthru and the C-seal, thereby hermetically sealed into the opening of the module box.

Abstract: An optical module box made of aluminum that has a reworkable glass-sealed fiber feedthru is disclosed. A fiber is inserted through a glass seal and a C-seal for hermetically sealing an opening in the optical module box. In a first embodiment, a module box employing a single-fiber fiber feedthru is described. In a second embodiment, a module box employing a 2-fiber feedthru is described. In a third embodiment, a module box employing a ribbon fiber feedthru is described. A module box having an opening with a single-fiber feedthru, comprising a C-seal; a glass sealed feedthru having a front tube and a back tube, the back tube of the glass sealed feedthru extending through the. C-seal; and a fiber passing through the glass sealed feedthru and the C-seal, thereby hermetically sealed into the opening of the module box.

Abstract: A light emitting diode device comprises a copper substrate having multiple light emitting regions, multiple dies and encapsulation. Each light emitting region has a die pad and at least one electrode connected together and encapsulant covering the light emitting region. The dies are respectively mounted on the die pads and are wire bonded to the corresponding electrode or electrodes. A step defining a gap is applied to the substrate to form multiple light emitting regions, and each light emitting region has a die pad and electrodes. Therefore, the present invention can simplify the steps for fabricating die pad and electrodes to increase the production rate of LED devices or LED display modules.

Abstract: A light emitting diode device comprises a copper substrate having multiple light emitting regions, multiple dies and encapsulation. Each light emitting region has a die pad and at least one electrode connected together and encapsulant covering the light emitting region. The dies are respectively mounted on the die pads and are wire bonded to the corresponding electrode or electrodes. A step defining a gap is applied to the substrate to form multiple light emitting regions, and each light emitting region has a die pad and electrodes. Therefore, the present invention can simplify the steps for fabricating die pad and electrodes to increase the production rate of LED devices or LED display modules.