Patents by Inventor Ching-Lin Chu

Ching-Lin Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9455490
    Abstract: A communication device integrally formed with antenna and mask is provided. The communication device comprises a circuit board, a frame, a communication chip and a mask. The frame is disposed on an upper surface of the circuit board. The frame has multiple sidewalls perpendicular to the upper surface and surrounding an opening. The communication chip is disposed on the upper surface and located in the opening. The mask is disposed on the circuit board, comprises a cover, multiple plates and an antenna module. The cover covers the communication chip. The plate is projected from a lower edge of the cover and parallel to the sidewalls, and has a hollowed area. The antenna module is connected to the hollowed area and integrally formed with the plate in one piece.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: September 27, 2016
    Assignee: SERCOMM CORPORATION
    Inventors: Yuan-Heng Huang, Ching-Lin Chu, Chung-Yen Hsiao
  • Publication number: 20140118197
    Abstract: A communication device integrally formed with antenna and mask is provided. The communication device comprises a circuit board, a frame, a communication chip and a mask. The frame is disposed on an upper surface of the circuit board. The frame has multiple sidewalls perpendicular to the upper surface and surrounding an opening. The communication chip is disposed on the upper surface and located in the opening. The mask is disposed on the circuit board, comprises a cover, multiple plates and an antenna module. The cover covers the communication chip. The plate is projected from a lower edge of the cover and parallel to the sidewalls, and has a hollowed area. The antenna module is connected to the hollowed area and integrally formed with the plate in one piece.
    Type: Application
    Filed: July 10, 2013
    Publication date: May 1, 2014
    Inventors: Yuan-Heng Huang, Ching-Lin Chu, Chung-Yen Hsiao
  • Patent number: D707664
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: June 24, 2014
    Assignee: Sercomm Corporation
    Inventor: Ching-Lin Chu
  • Patent number: D707665
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: June 24, 2014
    Assignee: Sercomm Corporation
    Inventor: Ching-Lin Chu