Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A laser cutting method for a wafer is provided. First, an active side of a wafer is cut by a laser to form multiple cutting grooves so that the thicker and harder layer of the integrated circuit on the active side is cut. Then the stealth laser is used to cut the backside of the wafer by aligning the beams of the stealth laser with the cutting grooves. Therefore, the cutting grooves easily extend to the backside of the wafer and penetrate through the wafer to dice the wafer into multiple independent chips.

Abstract: A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; and (b) cutting off supporting parts of the lead frame so as to form a connecting structure through which the light emitting diodes are connected to each other in one of serial, parallel, and serial-and-parallel connecting manners.

Abstract: A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.

Abstract: A lighting device includes: at least one lighting module including a lead frame and a plurality of light emitting diodes packaged on the lead frame; an upper plate disposed on the lead frame, and having at least one perforated region formed with a plurality of through-holes for extension of the light emitting diodes therethrough, and at least two conductor regions respectively provided on two sides of the perforated region, the conductor regions being connected electrically to the lead frame; a heat sink disposed below the lead frame; and a plurality of fasteners fastening the lighting module to the upper plate and the heat sink such that the heat sink is in tight contact with bottom ends of the light emitting diodes.

Abstract: A lighting device includes: at least one lighting module including a lead frame and a plurality of light emitting diodes packaged on the lead frame; an upper plate disposed on the lead frame, and having at least one perforated region formed with a plurality of through-holes for extension of the light emitting diodes therethrough, and at least two conductor regions respectively provided on two sides of the perforated region, the conductor regions being connected electrically to the lead frame; a heat sink disposed below the lead frame; and a plurality of fasteners fastening the lighting module to the upper plate and the heat sink such that the heat sink is in tight contact with bottom ends of the light emitting diodes.

Abstract: A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.

Abstract: A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; and (b) cutting off supporting parts of the lead frame so as to form a connecting structure through which the light emitting diodes are connected to each other in one of serial, parallel, and serial-and-parallel connecting manners.

Abstract: A solid state lighting device includes a heat-dissipating base, a diode chip, and a plurality of conductive terminals. The heat-dissipating base includes a base body formed integrally from a thermally conductive material. The base body has a top side, and is formed with a cavity that is indented from the top side. The base body further has a plurality of terminal channels, each of which extends from the cavity to an exterior of the base body. The diode chip is disposed in the cavity. Each of the conductive terminals extends through a respective one of the terminal channels, and has a first connecting part that is disposed in the cavity and that is coupled electrically to the diode chip, and a second connecting part that is disposed outwardly of the heat-dissipating base.

Abstract: A light emitting device includes: a heat dissipating unit including a metallic first heat sink having a chip-mounting area, a thermally conductive bonding layer, and a metallic second heat sink overlapping and attached to the first heat sink through the bonding layer such that the bonding layer is sandwiched between the first and second heat sinks, the heat dissipating unit being formed with a light exit window that is aligned with the chip-mounting area and that extends through the second heat sink and the bonding layer so as to expose the chip-mounting area; a light emitting chip attached to the chip-mounting area of the first heat sink for emitting light through the light exit window; and a transparent enclosing material filling the light exit window to enclose the light emitting chip.

Abstract: A lens includes a lens body having a bottom surface, a reflective surface, and a refractive surface. The bottom surface is to be disposed proximate to a light-emitting component. The reflective surface is disposed opposite to the bottom surface along a lens axis, and reflects a first portion of the light provided by the light-emitting component that is incident thereon toward the refractive surface. The refractive surface extends from an edge of the reflective surface to the bottom surface, and refracts a second portion of the light provided by the light-emitting component that is incident thereon as well as the first portion of the light reflected by the reflective surface theretoward in sideward directions relative to the light-emitting component. The lens body has cross-sections transverse to the lens axis, sizes of which increase gradually from a junction of the reflective surface and the refractive surface toward the bottom surface.

Abstract: A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external heat sink so as to achieve better heat dissipation. The slot is used for accommodating a LED chip that is electrically connected with a circuitry extension device through two electrical contacts. The LED chip is electrically connected with the circuitry extension device directly while it also connects with the base for heat dissipation, thus the structure for electricity conduction is separated from the structure for heat dissipation.