Patents by Inventor Ching-Ling Cheng

Ching-Ling Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9832399
    Abstract: An image sensor including a substrate, a trench isolation, a plurality of image sensing units, at least one phase detection unit, and an interconnection layer is provided. The trench isolation is in the substrate, and a plurality of active areas of the substrate are separated from each other by the trench isolation. The image sensing units and the at least one phase detection unit are in the active areas arranged in an array, and a sensing area of the at least one phase detection unit is smaller than a sensing area of each of the image sensing units. The interconnection layer is disposed on the image sensing units and the at least one phase detection unit. In addition, a method of fabricating an image sensor is also provided.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 28, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Yu Wei, Chin-Hsun Hsiao, Po-Chun Chiu, Yu-Hsuan Cheng, Yung-Lung Hsu, Hsin-Chi Chen, Ching-Ling Cheng
  • Publication number: 20170223285
    Abstract: An image sensor including a substrate, a trench isolation, a plurality of image sensing units, at least one phase detection unit, and an interconnection layer is provided. The trench isolation is in the substrate, and a plurality of active areas of the substrate are separated from each other by the trench isolation. The image sensing units and the at least one phase detection unit are in the active areas arranged in an array, and a sensing area of the at least one phase detection unit is smaller than a sensing area of each of the image sensing units. The interconnection layer is disposed on the image sensing units and the at least one phase detection unit. In addition, a method of fabricating an image sensor is also provided.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 3, 2017
    Inventors: Chia-Yu Wei, Chin-Hsun Hsiao, Po-Chun Chiu, Yu-Hsuan Cheng, Yung-Lung Hsu, Hsin-Chi Chen, Ching-Ling Cheng