Abstract: A method for handling a semiconductor substrate includes: placing a semiconductor substrate over a semiconductor apparatus, where a central portion of the semiconductor substrate overlies a carrying surface of a chuck table of the semiconductor apparatus, an edge portion of the semiconductor substrate overlies a top surface of a first flexible member of the semiconductor apparatus, the first flexible member is disposed within a recess of the chuck table and extends along a perimeter of the carrying surface, and a gap forms among the semiconductor substrate, the carrying surface of the chuck table, and the top surface of the first flexible member; and introducing a vacuum in vacuum holes in the chuck table to form a vacuum seal among the semiconductor substrate, the chuck table, and the first flexible member.

Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.

Abstract: An calibration kit includes a base, a combination of calibration parts, and a manipulation part. The combination of calibration parts is disposed on the base and includes a first calibration part and a second calibration part. The first calibration part has a first calibration surface. The second calibration part has a second calibration surface. The first calibration part and the second calibration part are relatively movable in a movement direction and are movable relative to the base. The manipulation part is movably or rotatably disposed on the base. The manipulation part is configured to be operable to drive the first calibration part and the second calibration part to move in the movement direction relative to the base, so that the combination of calibration parts forms a three-dimensional calibration surface configuration through the first calibration surface and the second calibration surface.

Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.

Abstract: An antenna with multi frequency ranges for communication in more bandwidths includes a dielectric substrate, a first subantenna, a second subantenna, a third subantenna, and first, second, and third isolators. The first to third subantennas are connected to the dielectric substrate and connect with signal sources. The first to third isolators are connected to the dielectric substrate and arranged to be between the first to third subantennas, to improve signal isolation between the subantennas. The application also provides an electronic device with the antenna having multiple frequency ranges. The antenna and the electronic device with the antenna enjoys reduced cross-interference between signals of the first subantenna, the second subantenna, and the third subantenna. The disclosure also provides an electronic device with the antenna.

Abstract: An antenna with multi frequency ranges for communication in more bandwidths includes a dielectric substrate, a first subantenna, a second subantenna, a third subantenna, and first, second, and third isolators. The first to third subantennas are connected to the dielectric substrate and connect with signal sources. The first to third isolators are connected to the dielectric substrate and arranged to be between the first to third subantennas, to improve signal isolation between the subantennas. The application also provides an electronic device with the antenna having multiple frequency ranges. The antenna and the electronic device with the antenna enjoys reduced cross-interference between signals of the first subantenna, the second subantenna, and the third subantenna. The disclosure also provides an electronic device with the antenna.

Abstract: A multi frequency ranges vehicle antenna able to transmit and receive over multiple frequencies including v2x includes a dielectric substrate, a first antenna, and second and third antennas. The first to third antennas are in parallel, vertically mounted, and are connected to the dielectric substrate. The first antenna is positioned between the second and third antennas. The first antenna is a 5G wideband antenna able to communicate in 2G, 3G, 4G, and 5G frequency bands, and the working frequency bands of the second and third antennas, which can work at the same time, are compatible with WiFi 6E and V2X frequency bands.

Abstract: A multi frequency ranges vehicle antenna able to transmit and receive over multiple frequencies including v2x includes a dielectric substrate, a first antenna, and second and third antennas. The first to third antennas are in parallel, vertically mounted, and are connected to the dielectric substrate. The first antenna is positioned between the second and third antennas. The first antenna is a 5G wideband antenna able to communicate in 2G, 3G, 4G, and 5G frequency bands, and the working frequency bands of the second and third antennas, which can work at the same time, are compatible with WiFi 6E and V2X frequency bands.

Abstract: An antenna structure includes a substrate and a plurality of radiation units, each radiation unit comprising a first radiator and a second radiator. The first radiator is positioned on a first surface of the substrate and includes a first radiation portion and a feed point. The feed point is electrically connected to the first radiation portion for feed current and signals to a corresponding radiation unit. The second radiator is positioned at a second surface of the substrate and is symmetrical with the first radiator about the substrate. The second radiator includes a second radiation portion and a ground portion. The ground portion is electrically connected to the second radiation portion to provide grounding for the radiation unit. The antenna structure has a good radiation efficiency and good isolation between radiators to reduce cross-interference.

Abstract: An antenna structure with wide radiation bandwidth includes a first radiation portion, a ground portion, a connection portion, a second radiation portion, and a feed portion. The ground portion is positioned at a plane perpendicular to plane of the first radiation portion. The ground portion is grounded. The connection portion connects to one side of the first radiation portion. The second radiation portion connects to one side of the connection portion away from the first radiation portion. The feed portion is electrically connected to the connection portion and the second radiation portion for feeding current and signals to the antenna structure.

Abstract: An antenna structure includes a substrate and a plurality of radiation units, each radiation unit comprising a first radiator and a second radiator. The first radiator is positioned on a first surface of the substrate and includes a first radiation portion and a feed point. The feed point is electrically connected to the first radiation portion for feed current and signals to a corresponding radiation unit. The second radiator is positioned at a second surface of the substrate and is symmetrical with the first radiator about the substrate. The second radiator includes a second radiation portion and a ground portion. The ground portion is electrically connected to the second radiation portion to provide grounding for the radiation unit. The antenna structure has a good radiation efficiency and good isolation between radiators to reduce cross-interference.

Abstract: An antenna structure with wide radiation bandwidth includes a first radiation portion, a ground portion, a connection portion, a second radiation portion, and a feed portion. The ground portion is positioned at a plane perpendicular to plane of the first radiation portion. The ground portion is grounded. The connection portion connects to one side of the first radiation portion. The second radiation portion connects to one side of the connection portion away from the first radiation portion. The feed portion is electrically connected to the connection portion and the second radiation portion for feeding current and signals to the antenna structure.