Abstract: A memory device, a semiconductor device and manufacturing methods for forming the memory device and the semiconductor device are provided. The memory device include a stacking structure, a switching layer, channel layers and pairs of conductive pillars. The stacking structure includes alternately stacked isolation layers and word lines, and extends along a first direction. The stacking structure has a staircase portion and a connection portion at an edge region of the stacking structure. The connection portion extends along the staircase portion and located aside the staircase portion, and may not be shaped into a staircase structure. The switching layer covers a sidewall of the stacking structure. The channel layers cover a sidewall of the switching layer, and are laterally spaced apart from one another along the first direction. The pairs of conductive pillars stand on the substrate, and in lateral contact with the switching layer through the channel layers.

Abstract: A ferroelectric memory device includes a semiconductor structure, a stack structure disposed on the semiconductor structure and including multiple dielectric layers and multiple conductive layers that are alternatingly stacked, and multiple memory arrays extending through the stack structure. Each of the memory arrays includes two spaced-apart memory segments connecting to the stack structure, multiple spaced-apart channel portions each being connected to a corresponding one of the memory segments, and multiple pairs of source/bit lines that are spaced apart from each other. Each of the pairs of the source/bit lines is connected between corresponding two of the channel portions. The ferroelectric memory device further includes multiple carrier structures each being connected to one of the source/bit lines in a corresponding one of the pairs of the source/bit lines, and being separated from the other one of the source/bit lines in the corresponding one of the pairs of the source/bit lines.

Abstract: A semiconductor device includes a substrate, an active structure, a memory structure, and a first conductive line. The active structure is disposed on the substrate. The memory structure is disposed over the active structure, and has a lower surface and an upper surface opposite to each other. The memory structure includes a deep via disposed in the memory structure, and extends in an upward direction from the lower surface to terminate at the upper surface. The first conductive line is disposed above the upper surface of the memory structure, and extends in a first lengthwise direction transverse to the upward direction. The first conductive line is electrically connected to the active structure through the deep via. A method for manufacturing the semiconductor device is also disclosed.

Abstract: A semiconductor device comprises a first conductive structure extending along a vertical direction and a second conductive structure extending along the vertical direction. The second conductive structure is spaced apart from the first conductive structure along a lateral direction. The semiconductor device further comprises a plurality of third conductive structures each extending along the lateral direction. The plurality of third conductive structures are disposed across the first and second conductive structures. The first and second conductive structures each have a varying width along the lateral direction. The plurality of third conductive structures are configured to be applied with respective different voltages in accordance with the varying width of the first and second conductive structures.

Abstract: A resistive random access memory is provided. The resistive random access memory includes a conductive line structure and a memory unit. The conductive line structure is disposed in an array area and a periphery circuit area. The memory unit is disposed on the conductive line structure in the array area. The memory unit includes a lower electrode, a resistive switching layer, and an upper electrode. The lower electrode is disposed on the conductive line structure. The resistive switching layer is disposed on the lower electrode. The upper electrode is disposed on the resistive switching layer. The upper surface of the conductive line structure is in direct contact with the lower electrode.

Abstract: A memory device includes a first layer, wherein the first layer includes a first memory array, a first row decoder circuit, and a first column sensing circuit. The memory device includes a second layer disposed with respect to the first layer in a vertical direction. The second layer includes a first peripheral circuit operatively coupled to the first memory array, the first row decoder circuit, and the first column sensing circuit. The memory device includes a plurality of interconnect structures extending along the vertical direction. At least a first one of the plurality of interconnect structures operatively couples the second layer to the first layer.

Abstract: A hydrophobic polyvinyl alcohol and a method for preparing hydrophobic polyvinyl alcohol are provided. The hydrophobic polyvinyl alcohol includes a first repeat unit represented by Formula (I), a second repeat unit represented by Formula (II), and a third repeat unit represented by Formula (III) wherein R1 is —Si(R2)3, R2 is independently C1-6 alkoxy group, C6-18 alkyl group, or C6-22 alkenyl group, and at least one R2 is C6-18 alkyl group or C6-22 alkenyl group; R3 and R4 are independently C6-18 alkyl group or C6-22 alkenyl group; j is 3 to 7; and k is 1 to 30.

Abstract: A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a metal oxide layer including a plurality of conductive filament regions formed on the bottom electrode, and a plurality of top electrodes formed on the metal oxide layer, corresponding to the respective conductive filament regions. Each of the conductive filament regions has a bottom portion and a top portion. The width of the bottom portion is greater than that of the top portion. The conductive filament regions include oxygen vacancies, and regions other than the conductive filament regions in the metal oxide layer are nitrogen-containing regions.

Abstract: A method for manufacturing a semiconductor device, including the following steps. A plurality of first vias are formed in a first dielectric layer in a memory cell region and a peripheral region. A surface treatment is performed on the plurality of first vias to form a plurality of sacrificial layers. The plurality of sacrificial layers are removed to form a plurality of recesses. A plurality of protective layers are formed in the plurality of recesses. A memory device is formed on the first dielectric layer in the memory cell region. A second dielectric layer is formed on the memory device and on the first dielectric layer. A plurality of second vias is formed in the second dielectric layer in the memory cell region and the peripheral region to electrically connect the memory device in the memory cell region and the first vias in the peripheral region, respectively.

Abstract: This disclosure provides a novel method for detecting one or more cell-bound complement activation products (CB-CAPs) using a capillary tube agglutination/lattice formation test. The method as disclosed has a wide variety of applications, including diagnosing or monitoring lupus or pre-lupus and other diseases or disorders (e.g., autoimmune or inflammatory diseases or disorders).

Abstract: A memory device includes a first layer, wherein the first layer includes a first memory array, a first row decoder circuit, and a first column sensing circuit. The memory device includes a second layer disposed with respect to the first layer in a vertical direction. The second layer includes a first peripheral circuit operatively coupled to the first memory array, the first row decoder circuit, and the first column sensing circuit. The memory device includes a plurality of interconnect structures extending along the vertical direction. At least a first one of the plurality of interconnect structures operatively couples the second layer to the first layer.

Abstract: Disclosed herein are related to a memory array including one-time programmable (OTP) cells. In one aspect, the memory array includes a set of OTP cells including a first subset of OTP cells connected between a first program control line and a first read control line. Each OTP cell of the first subset of OTP cells may include a programmable storage device and a switch connected between the first program control line and the first read control line. The first program control line may extend towards a first side of the memory array along a first direction, and the first read control line may extend towards a second side of the memory array facing away from the first side of the memory array.

Abstract: Disclosed herein are related to a memory array. In one aspect, the memory array includes a first set of memory cells including a first subset of memory cells and a second subset of memory cells. In one aspect, the memory array includes a first switch including a first electrode connected to first electrodes of the first subset of memory cells, and a second electrode connected to a first global line. In one aspect, the memory array includes a second switch including a first electrode connected to first electrodes of the second subset of memory cells, and a second electrode connected to the first global line.

Abstract: Disclosed herein are related to a memory array including a set of memory cells and a set of switches to configure the set of memory cells. In one aspect, each switch is connected between a corresponding local line and a corresponding subset of memory cells. The local clines may be connected to a global line. Local lines may be metal rails, for example, local bit lines or local select lines. A global line may be a metal rail, for example, a global bit line or a global select line. A switch may be enabled or disabled to electrically couple a controller to a selected subset of memory cells through the global line. Accordingly, the set of memory cells can be configured through the global line rather than a number of metal rails to achieve area efficiency.

Abstract: Disclosed herein are related to a memory array. In one aspect, the memory array includes a set of resistive storage circuits including a first subset of resistive storage circuits connected between a first local line and a second local line in parallel. The first local line and the second local line may extend along a first direction. In one aspect, for each resistive storage circuit of the first subset of resistive storage circuits, current injected at a first common entry point of the first local line exits through a first common exit point of the second local line, such that each resistive storage circuit of the first subset of resistive storage circuits may have same or substantial equal resistive loading.

Abstract: A memory device includes a first signal line, a second signal line, a first memory cell and a plurality of second memory cells. The first memory cell is coupled to the first signal line. Each of the second memory cells has a first terminal coupled to the first signal line through the first memory cell and a second terminal coupled to the second signal line.

Abstract: A memory circuit includes first and second circuits. The first circuit includes a DRAM array including a plurality of bit lines, and the second circuit includes a computation circuit including a sense amplifier circuit. A boundary layer is positioned between the first and second circuits, and the boundary layer includes a plurality of via structures configured to electrically connect the plurality of bit lines to the sense amplifier circuit.

Abstract: In some embodiments, an integrated circuit (IC) device includes an active semiconductor layer, a circuitry formed within the active semiconductor layer, a region including conductive layers formed above the active semiconductor layer, and a memory module formed in the region. The memory device includes a three-dimensional array of memory cells, each adapted to store a weight value, and adapted to generate at each memory cell a signal indicative of a product between the stored weight value and an input signal applied to the memory cell. The memory module is further adapted to transmit the product signals from the memory cell simultaneously in the direction of the active semiconductor layer.

Abstract: A device includes a multiplication unit and a configurable summing unit. The multiplication unit is configured to receive data and weights for an Nth layer, where N is a positive integer. The multiplication unit is configured to multiply the data by the weights to provide multiplication results. The configurable summing unit is configured by Nth layer values to receive an Nth layer number of inputs and perform an Nth layer number of additions, and to sum the multiplication results and provide a configurable summing unit output.

Abstract: A memory device including a memory array configured to store data, a sense amplifier circuit coupled to the memory array, and a read circuit coupled to the sense amplifier circuit, wherein the read circuit includes a first input that receives a read column select signal for activating the read circuit to read the data out of the memory array through the read circuit during a read operation.