Patents by Inventor Ching LO
Ching LO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250115425Abstract: A stocking vehicle is provided. The stocking vehicle is configured to perform a stocking operation to transfer a first product unit from a first location to a second location. The stocking vehicle includes a stocking component. The stocking vehicle includes a motor coupled to the stocking component to facilitate performance of the stocking operation by the stocking component. The stocking vehicle includes an energy storage device configured to supply first energy to the motor during a first state of the motor and store second energy of the motor during a second state of the motor.Type: ApplicationFiled: October 9, 2023Publication date: April 10, 2025Inventors: Chun Cheng LIU, Guancyun Li, Ching-Jung Chang, Yi-Ching Lo
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Publication number: 20240198651Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.Type: ApplicationFiled: February 29, 2024Publication date: June 20, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Jie Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
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Patent number: 11993066Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.Type: GrantFiled: August 5, 2021Date of Patent: May 28, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Jie Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
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Publication number: 20240123117Abstract: The inventions provided herein relate to compositions, methods, delivery devices and kits for repairing or augmenting a tissue in a subject. The compositions described herein can he injectable such that they can be placed in a tissue to be treated with a minimally-invasive procedure (e.g., by injection). In some embodiments, the composition described herein comprises a compressed silk fibroin matrix, which can expand upon injection into the tissue and retain its original expanded volume within the tissue for a period of time. The compositions can be used as a filler to replace a tissue void, e.g., for tissue repair and/or augmentation, or as a scaffold to support tissue regeneration and/or reconstruction. In some embodiments, the compositions described herein can be used for soft tissue repair or augmentation.Type: ApplicationFiled: May 30, 2023Publication date: April 18, 2024Inventors: Gary G. Leisk, Tim Jai-Ching Lo, Lei Li, Evangelia Bellas, David L. Kaplan
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Publication number: 20240063048Abstract: A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardness scale of the gas permeable buffer layer is smaller than a hardness scale of the supporting platform.Type: ApplicationFiled: August 16, 2022Publication date: February 22, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Ching Lo, Ching-Pin Yuan, Wei-Jie Huang, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
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Publication number: 20240017538Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.Type: ApplicationFiled: August 2, 2023Publication date: January 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Jie Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
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Publication number: 20230340489Abstract: The present disclosure provides compositions and methods for treating amyotrophic lateral sclerosis (ALS). Among other things, the present disclosure provides inhibitory nucleic acids that inhibit the expression of genes that cause or are implicated in ALS pathogenesis. The present disclosure further provides recombinant adeno-associated virus (rAAV) vectors comprising inhibitory nucleic acids that inhibit the expression of genes that cause or are implicated in ALS pathogenesis.Type: ApplicationFiled: September 15, 2021Publication date: October 26, 2023Inventors: Shih-Ching Lo, Alexander McCampbell, Maria Zavodszky, Edward Guilmette, Barret Pfeiffer
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Publication number: 20230307404Abstract: A package structure includes a die, a first redistribution circuit structure, a first redistribution circuit structure, a second redistribution circuit structure, an enhancement layer, first conductive terminals, and second conductive terminals. The first redistribution circuit structure is disposed on a rear side of the die and electrically coupled to thereto. The second redistribution circuit structure is disposed on an active side of the die and electrically coupled thereto. The enhancement layer is disposed on the first redistribution circuit structure. The first redistribution circuit structure is disposed between the enhancement layer and the die. The first conductive terminals are connected to the first redistribution circuit structure. The first redistribution circuit structure is between the first conductive terminals and the die. The second conductive terminals are connected to the second redistribution circuit structure.Type: ApplicationFiled: March 28, 2022Publication date: September 28, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Yu Kuo, Yu-Ching Lo, Wei-Jie Huang, Ching-Pin Yuan, Yi-Che Chiang, Kris Lipu Chuang, Hsin-Yu Pan, Yi-Yang Lei, Ching-Hua Hsieh, Kuei-Wei Huang
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Patent number: 11760876Abstract: A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.Type: GrantFiled: October 29, 2021Date of Patent: September 19, 2023Assignee: ELITE MATERIAL CO., LTD.Inventors: Chen-Yu Hsieh, Chih-Wei Lin, Ching Lo
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Patent number: 11701450Abstract: The inventions provided herein relate to compositions, methods, delivery devices and kits for repairing or augmenting a tissue in a subject. The compositions described herein can be injectable such that they can be placed in a tissue to be treated with a minimally-invasive procedure (e.g., by injection). In some embodiments, the composition described herein comprises a compressed silk fibroin matrix, which can expand upon injection into the tissue and retain its original expanded volume within the tissue for a period of time. The compositions can be used as a filler to replace a tissue void, e.g., for tissue repair and/or augmentation, or as a scaffold to support tissue regeneration and/or reconstruction. In some embodiments, the compositions described herein can be used for soft tissue repair or augmentation.Type: GrantFiled: September 22, 2016Date of Patent: July 18, 2023Assignee: TRUSTEES OF TUFTS COLLEGEInventors: Gary G. Leisk, Tim Jia-Ching Lo, Lei Li, Evangelia Bellas, David L. Kaplan
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Patent number: 11630177Abstract: Systems and Methods that identify the effect of motion during a medical imaging procedure. A neural network is trained to translate motion induced deviations of a coil-mixing matrix relative to a reference acquisition into a motion score. This score can be used for the prospective detection of the most corrupted echo trains for removal or triggering a replacement by reacquisition.Type: GrantFiled: April 13, 2022Date of Patent: April 18, 2023Assignees: Siemens Healthcare GmbH, The General Hospital CorporationInventors: Daniel Nicolas Splitthoff, Julian Hossbach, Daniel Polak, Stephen Farman Cauley, Bryan Clifford, Wei-Ching Lo
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Publication number: 20230062178Abstract: A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.Type: ApplicationFiled: October 29, 2021Publication date: March 2, 2023Inventors: Chen-Yu HSIEH, Chih-Wei LIN, Ching LO
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Patent number: 11555271Abstract: The present invention relates to an artificial leather and a method for producing the same. The artificial leather includes a substrate, a thermoplastic polyurethane fiber adhesive layer, a thermoplastic polyurethane fiber layer, a paste layer, and a surface layer. The paste layer has a thermosetting paste or a high solid-content paste, and the paste has a specific adhesive temperature. A bonding can be performed at low temperature in the method for producing the same, and the artificial leather made by the method for producing the same has excellent hand feeling and/or smoothness.Type: GrantFiled: November 16, 2020Date of Patent: January 17, 2023Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chien-Chia Huang, Chia-Ho Lin, Yen-Lun Tseng, Chin-Wei Chen, Ching-Lo Lin
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Publication number: 20220342018Abstract: Systems and Methods that identify the effect of motion during a medical imaging procedure. A neural network is trained to translate motion induced deviations of a coil-mixing matrix relative to a reference acquisition into a motion score. This score can be used for the prospective detection of the most corrupted echo trains for removal or triggering a replacement by reacquisition.Type: ApplicationFiled: April 13, 2022Publication date: October 27, 2022Inventors: Daniel Nicolas Splitthoff, Julian Hossbach, Daniel Polak, Stephen Farman Cauley, Bryan Clifford, Wei-Ching Lo
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Publication number: 20220314595Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.Type: ApplicationFiled: August 5, 2021Publication date: October 6, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Jie Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
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Patent number: 11293973Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.Type: GrantFiled: November 17, 2020Date of Patent: April 5, 2022Assignee: MPI CORPORATIONInventors: Wen Pin Chuang, Yi Ching Lo
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Patent number: 11266339Abstract: Provided herein relates to implantable devices and systems with dynamic silk coatings. In some embodiments, the dynamic silk coatings can be formed in situ or in vivo.Type: GrantFiled: May 9, 2019Date of Patent: March 8, 2022Assignee: Trustees of Tufts CollegeInventors: David L. Kaplan, Lee W. Tien, Gary G. Leisk, Tim Jia-Ching Lo, Cinzia Metallo, Fiorenzo Omenetto
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Patent number: 11162996Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.Type: GrantFiled: September 30, 2020Date of Patent: November 2, 2021Assignee: MPI CORPORATIONInventors: Wen Pin Chuang, Yi Ching Lo, Hao Duan
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Publication number: 20210262161Abstract: The present invention relates to an artificial leather and a method for producing the same. The artificial leather includes a substrate, a thermoplastic polyurethane fiber adhesive layer, a thermoplastic polyurethane fiber layer, a paste layer, and a surface layer. The paste layer has a thermosetting paste or a high solid-content paste, and the paste has a specific adhesive temperature. A bonding can be performed at low temperature in the method for producing the same, and the artificial leather made by the method for producing the same has excellent hand feeling and/or smoothness.Type: ApplicationFiled: November 16, 2020Publication date: August 26, 2021Inventors: Chih-Yi LIN, Kuo-Kuang CHENG, Chien-Chia HUANG, Chia-Ho LIN, Yen-Lun TSENG, Chin-Wei CHEN, Ching-Lo LIN
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Publication number: 20210156907Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.Type: ApplicationFiled: November 17, 2020Publication date: May 27, 2021Applicant: MPI CORPORATIONInventors: WEN PIN CHUANG, YI CHING LO