Patents by Inventor Ching-Lun Hsia

Ching-Lun Hsia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR WIRE BONDING AND METHOD
    Publication number: 20160379953
    Abstract: Circuitry is disclosed that includes a first conductive portion of a first die and a first conductive pillar electrically and physically connected to the first conductive portion. The first conductive pillar includes a first conductive pillar surface. A first bond connects the first conductive pillar surface to a first end of a bond wire.
    Type: Application
    Filed: June 24, 2015
    Publication date: December 29, 2016
    Inventors: Patrick Francis Thompson, Jeffrey Alan West, Thomas D. Bonifield, Fu-Kang Hsu, Ching-Lun Hsia