Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: An endoscopy auxiliary device includes an insertion tube and a clamping unit. The clamping unit has a pipe and a connector. The connector is connected to the insertion tube. The tube is configured to clamp a capsule endoscope. The pipe has an inner space configured to accommodate a part of the capsule endoscope. The pipe includes a first slit, a second slit and a third slit. The first slit extends from a free end of the pipe for a first distance toward a connection end of the pipe. The second slit extends from the free end of the pipe for the connection distance toward the connection end of the pipe. The third slit extends from the free end of the pipe for a third distance toward the connection end of the pipe. The first slit, the second slit and the third slit are separate.

Abstract: A pipeline collector is used for bundling at least one hose. The pipeline collector comprises at least one bundling member corresponding to the hoses and is characterized in that each of the bundling members comprises a bundling body, a first top edge positioned at one side of the bundling body, a second top edge defined at the other side of the bundling body relative to the first top edge, and a first accommodation area which is recessed from the surface of the bundling body relative to the hoses and penetrates through the first top edge and the second top edge, wherein a profile of the first accommodation area is non-orthogonally disposed relative to the first top edge or the second top edge.

Abstract: An endoscopy auxiliary device includes an insertion tube and a clamping unit. The clamping unit has a pipe and a connector. The connector is connected to the insertion tube. The tube is configured to clamp a capsule endoscopy. The pipe has an inner space configured to accommodate a part of the capsule endoscopy. The pipe includes a first slit, a second slit and a third slit. The first slit extends from a free end of the pipe for a first distance toward a connection end of the pipe. The second slit extends from the free end of the pipe for the connection distance toward the connection end of the pipe. The third slit extends from the free end of the pipe for a third distance toward the connection end of the pipe. The first slit, the second slit and the third slit are separated from each other.