Patents by Inventor Ching-Mao Huang

Ching-Mao Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961637
    Abstract: This disclosure relates to a stretchable composite electrode and a fabricating method thereof, and particularly relates to a stretchable composite electrode including a silver nanowire layer and a flexible polymer film and a fabricating method thereof.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 16, 2024
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Wei Sheng Chen, Ching Mao Huang, Jia Hui Zhou, Huan Ran Yu, Shu Xiong Wang, Chin Hui Lee
  • Patent number: 11302545
    Abstract: The present disclosure provides a system and a method for controlling semiconductor manufacturing equipment. The system includes a sensor, a sensor interface, and an analysis unit. The sensor provides a sensor signal. The sensor interface receives the sensor signal and generates an input signal for a database server. A front-end subsystem receives the input signal from the database server and performs a comparison process to generate a data signal. A calculation subsystem performs an artificial intelligence analytical process to generate an optimal parameter set and a simulated result map according to the data signal. A message and tuning subsystem generates an alert signal and a feedback signal according to the optimal parameter set and the simulated result map, and the message and tuning subsystem transmits the alert message to a user of the semiconductor manufacturing equipment.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: April 12, 2022
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Jheng-Ting Jhong, Wei-Pin Lin, Ching-Mao Huang
  • Patent number: 11262879
    Abstract: A touch module includes a substrate, a touch sensing layer, a first transparent adhesive layer, and a second transparent adhesive layer. The substrate has a visible area and a peripheral area surrounding the visible area. The touch sensing layer is disposed on the substrate and located in the visible area. The first transparent adhesive layer is disposed on the touch sensing layer, and a dielectric constant of the first transparent adhesive layer is between 1.5 and 3.0. The second transparent adhesive layer is disposed on the first transparent adhesive layer, and a dielectric constant of the second transparent adhesive layer is between 3.0 and 8.0.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: March 1, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Huang Chen, Wei-Sheng Chen, Ching-Mao Huang
  • Publication number: 20210296148
    Abstract: The present disclosure provides a system and a method for controlling semiconductor manufacturing equipment. The system includes a sensor, a sensor interface, and an analysis unit. The sensor provides a sensor signal. The sensor interface receives the sensor signal and generates an input signal for a database server. A front-end subsystem receives the input signal from the database server and performs a comparison process to generate a data signal. A calculation subsystem performs an artificial intelligence analytical process to generate an optimal parameter set and a simulated result map according to the data signal. A message and tuning subsystem generates an alert signal and a feedback signal according to the optimal parameter set and the simulated result map, and the message and tuning subsystem transmits the alert message to a user of the semiconductor manufacturing equipment.
    Type: Application
    Filed: March 20, 2020
    Publication date: September 23, 2021
    Inventors: Jheng-Ting JHONG, WEI-PIN LIN, CHING-MAO HUANG
  • Patent number: 10213758
    Abstract: A polymer is disclosed, which includes a structure of Formula 1 or Formula 2. R1 is a C2-18 alkylene group or a C6-18 arylene group, R2 is a C1-18 alkyl group, and R3 is a functional group of Formula 3. Each of X1, X2, X3, X4, X5, and X6, being the same or different, is H or methyl. Each of p, q, and r, being the same or different, is an integer of 1 to 60. R4 is —C2H4—, —C3H6—, Each of m and n, being the same or different, is an integer of 0 to 50, and m+n?0.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: February 26, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cha-Wen Chang, Ching-Mao Huang, Shinn-Jen Chang, Yu-Hui Chen, Wan-Jung Teng, Shu-Ya Tsai, Jen-Yu Chen
  • Publication number: 20170128899
    Abstract: A polymer is disclosed, which includes a structure of Formula 1 or Formula 2. R1 is a C2-18 alkylene group or a C6-18 arylene group, R2 is a C1-18 alkyl group, and R3 is a functional group of Formula 3. Each of X1, X2, X3, X4, X5, and X6, being the same or different, is H or methyl. Each of p, q, and r, being the same or different, is an integer of 1 to 60. R4 is —C2H4—, —C3H6—, Each of m and n, being the same or different, is an integer of 0 to 50, and m+n?0.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 11, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cha-Wen CHANG, Ching-Mao HUANG, Shinn-Jen CHANG, Yu-Hui CHEN, Wan-Jung TENG, Shu-Ya TSAI, Jen-Yu CHEN
  • Publication number: 20060041048
    Abstract: A method for manufacturing polymer-silicate nanocomposite material is used to produce the polymer-silicate nanocomposite material by combining organic silicate layer with polyol for carrying out an polymerization, while nanophase silicate layers are evenly distributed over the polyol, so that the polyurethane-material-formed products made by polyol will be provided with good engineering properties, such as low expansion coefficient, high heat resistance, low hygroscopic coefficient, low permeability and light transmission that has no effect on the high polymer material. And thus, the market competitiveness of the product is accordingly improved.
    Type: Application
    Filed: August 19, 2004
    Publication date: February 23, 2006
    Inventors: Kung-Hwa Wei, Ching-Mao Huang, Rocky Shih