Patents by Inventor Ching-Min Chen

Ching-Min Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130038
    Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 18, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Chin-Hsun WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Hung, Wei-Yu Liao, Chi-Min Chang
  • Publication number: 20240128626
    Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.
    Type: Application
    Filed: November 25, 2022
    Publication date: April 18, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Yu-Kuang WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Huang, Wei-Yu Liao, Chi-Min Chang
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11916471
    Abstract: An example electronic device includes a controller to determine a user touch detection by a power adaptor coupled to the electronic device to operate the electronic device in an AC power mode. The power adaptor may comprise a proximity sensor to detect a user touch for detachment of the power adaptor from the electronic device, and a control circuit to operate a configuration pin in a low output mode to signal user touch detection. The controller may initiate central processing unit (CPU) throttling to reduce power consumption by the electronic device. The controller may further stop CPU throttling in response to detecting that the power adaptor has been detached from the electronic device. Further, the controller may switch the electronic device to a DC power mode to operate using DC power supplied by a battery of the electronic device in response to power adaptor detachment.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: February 27, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ting-Yang Tsai, Yi-Chen Chen, Ching-Lung Wang, Yu-Min Shen
  • Publication number: 20240055179
    Abstract: A power transformer having a noise reduction function includes a transformer housing and an electromagnetic assembly. The transformer housing includes a sidewall and an accommodating space surrounded by the sidewall, and the sidewall has a vacuum layer formed therein. The electromagnetic assembly is disposed in the accommodating space and includes an iron core and a coil structure disposed on the iron core. The transformer housing can include at least one hollow reinforcing structure disposed on an outer wall of the sidewall and filled with an anti-vibration material.
    Type: Application
    Filed: February 3, 2023
    Publication date: February 15, 2024
    Inventors: CHIA-CHING LIN, CHING-MIN CHEN
  • Patent number: 11015825
    Abstract: An intelligent air-drying system and method are provided. The intelligent air-drying system includes an air-drying device and an application program. The air-drying device includes a device body, a sensing unit, a heater, and a processing unit. The device body has a water-absorbing material for absorbing moisture in the air. The sensing unit is disposed on the device body to detect the humidity of the environment where the air-drying device is located. The heater is disposed on the device body to heat the water-absorbing material. The processing unit is coupled to the sensing unit and the heater, and the processing unit executes the application program. The startup timing of the heater is dynamically predicted based on the daily humidity change measured by the sensing unit, and the heater is started before the water-absorbing material reaches saturation to ensure the water-absorbing and dehumidifying capabilities of the water-absorbing material.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: May 25, 2021
    Assignee: FORTUNE ELECTRIC CO., LTD.
    Inventors: Chia-Ching Lin, Ching-Min Chen
  • Publication number: 20210018197
    Abstract: An intelligent air-drying system and method are provided. The intelligent air-drying system includes an air-drying device and an application program. The air-drying device includes a device body, a sensing unit, a heater, and a processing unit. The device body has a water-absorbing material for absorbing moisture in the air. The sensing unit is disposed on the device body to detect the humidity of the environment where the air-drying device is located. The heater is disposed on the device body to heat the water-absorbing material. The processing unit is coupled to the sensing unit and the heater, and the processing unit executes the application program. The startup timing of the heater is dynamically predicted based on the daily humidity change measured by the sensing unit, and the heater is started before the water-absorbing material reaches saturation to ensure the water-absorbing and dehumidifying capabilities of the water-absorbing material.
    Type: Application
    Filed: July 19, 2019
    Publication date: January 21, 2021
    Inventors: CHIA-CHING LIN, CHING-MIN CHEN
  • Patent number: 10612852
    Abstract: Disclosed are a transformer system and a control method of an air-drying device thereof. The air-drying device has a desiccant material stored therein and is connected to a transformer for removing water from an airflow entering the transformer. The control method includes the following steps. The first step is detecting a weight of the desiccant material. The next step is determining whether the weight of the desiccant material reaches a first predetermined weight. The next step is determining whether the transformer is in an air inflow state or an air outflow state, and is conducted when the weight of the desiccant material reaches a first predetermined weight. The last step is heating the desiccant material, and is conducted when the transformer is the air outflow state. Therefore, the lifetime of the transformer can be remarkably extended.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: April 7, 2020
    Assignee: FORTUNE ELECTRIC CO., LTD.
    Inventors: Chia-Ching Lin, Ching-Min Chen
  • Publication number: 20190212058
    Abstract: Disclosed are a transformer system and a control method of an air-drying device thereof. The air-drying device has a desiccant material stored therein and is connected to a transformer for removing water from an airflow entering the transformer. The control method includes the following steps. The first step is detecting a weight of the desiccant material. The next step is determining whether the weight of the desiccant material reaches a first predetermined weight. The next step is determining whether the transformer is in an air inflow state or an air outflow state, and is conducted when the weight of the desiccant material reaches a first predetermined weight. The last step is heating the desiccant material, and is conducted when the transformer is the air outflow state. Therefore, the lifetime of the transformer can be remarkably extended.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventors: CHIA-CHING LIN, CHING-MIN CHEN
  • Patent number: 9646761
    Abstract: A power transmission transformer (1) includes a transformer body (11). Each of two upper pipings (3) is connected between the transformer body (11) and one of two heat dissipators (2, 21) outside of the transformer body (11). Each of two lower pipings (4) is connected between the transformer body (11) and one of the heat dissipators (2, 21). A sound absorbing device (6, 61) is mounted between and spaced from one of two sidewalls of the transformer body (11) and one of the heat dissipators (2, 21). The sound absorbing device (6, 61) is fixed to one of the upper pipings (3) and one of the lower pipings (4). An outer wallboard (63) and a sound absorbing material (64) are respectively mounted to two sides of at least one fixing frame (62) of the sound absorbing device (6, 61).
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: May 9, 2017
    Assignee: Fortune Electric Co., Ltd.
    Inventors: Chia-Ching Lin, Ching-Min Chen
  • Publication number: 20170032890
    Abstract: A power transmission transformer (1) includes a transformer body (11). Each of two upper pipings (3) is connected between the transformer body (11) and one of two heat dissipators (2, 21) outside of the transformer body (11). Each of two lower pipings (4) is connected between the transformer body (11) and one of the heat dissipators (2, 21). A sound absorbing device (6, 61) is mounted between and spaced from one of two sidewalls of the transformer body (11) and one of the heat dissipators (2, 21). The sound absorbing device (6, 61) is fixed to one of the upper pipings (3) and one of the lower pipings (4). An outer wallboard (63) and a sound absorbing material (64) are respectively mounted to two sides of at least one fixing frame (62) of the sound absorbing device (6, 61).
    Type: Application
    Filed: July 28, 2015
    Publication date: February 2, 2017
    Inventors: Chia-Ching Lin, Ching-Min Chen